IC Packaging Design Intern — High-Speed Networking

semtech; Ottawa; On-site; CAD 36,000 - 40,000; Full time

Job summary

Semtech Canada in Ottawa is offering a 12-16 month IC packaging design internship in the Signal Integrity Products Group. As an integral team member, you'll learn through direct involvement and take on tasks that grow in complexity.

The program emphasizes hands-on experience and collaboration within a fast-paced research environment. The internship includes mentoring from senior packaging engineers, with a focus on IC chip carrier design, high-speed layout support, and assisting 3D EM

Qualifications

• Experience with advanced manufacturing or electronics is a strong asset.
• Ability to learn quickly and work independently or in a team.
• Familiarity with CAD tools such as Cadence Allegro or mechanical CAD software is desirable.

Responsibilities

• Design IC chip carriers for electronic components or pluggable modules.
• Use CAD tools to support layout of high-density transmission lines and power domains.
• Develop physical assemblies and mechanical outlines.
• Support layout generation for 3D EM simulations and thermo-mechanical analysis.
• Mentoring from senior packaging engineers during the internship.

Skills

Advanced manufacturing

Fast learner

Teamwork

Analog electronics

Tolerance analysis

Frequency analysis

Tools

Cadence Allegro

Keysight ADS

AutoCAD

DraftSight

SolidWorks

Job description

Semtech Canada in Ottawa is offering a 12-16 month IC packaging design internship in the Signal Integrity Products Group. As an integral team member, you'll learn through direct involvement and take on tasks that grow in complexity.

The program emphasizes hands-on experience and collaboration within a fast-paced research environment. The internship includes mentoring from senior packaging engineers, with a focus on IC chip carrier design, high-speed layout support, and assisting 3D EM