IC Packaging Design Intern: High-Speed PCB & 3D Layout

Sierra Wireless; Ottawa; On-site; CAD 36,000 - 40,000; Full time

Job summary

Semtech Canada is offering a 12–16 month IC packaging design internship in Ottawa, starting May 2027. The role involves designing IC chip carriers and supporting high-density, high-speed transmission layouts under the SIP group.

You will work with senior engineers, gain hands-on CAD design experience with Allegro/AutoCAD/SolidWorks, and learn to apply signal integrity concepts in a collaborative team environment.

Qualifications

• 12–16 month IC packaging internship starting May 2027.
• Hands-on CAD design experience desired.
• Strong ability to learn and work in a team.
• Familiarity with high-speed signal integrity concepts is a plus.
• Exposure to CAD tools such as Cadence Allegro, AutoCAD, SolidWorks is preferred.

Responsibilities

• Design IC chip carriers for components or modules.
• Create layouts for high-density high-speed transmission lines.
• Assist with 3D electromagnetic simulations and thermo-mechanical analysis.
• Work with senior packaging engineers and mentors.

Skills

Learn quickly

Teamwork

Independent work

Adaptability

Education

Student in Electrical/Mechanical Engineering

Tools

Cadence Allegro

Keysight ADS

AutoCAD

DraftSight

SolidWorks

Job description

Semtech Canada is offering a 12–16 month IC packaging design internship in Ottawa, starting May 2027. The role involves designing IC chip carriers and supporting high-density, high-speed transmission layouts under the SIP group.

You will work with senior engineers, gain hands-on CAD design experience with Allegro/AutoCAD/SolidWorks, and learn to apply signal integrity concepts in a collaborative team environment.