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Kosmic Technologies is seeking a Senior Process Yield Integration Engineer to optimize wafer bumping yield and integrate bump processes. You will collaborate with cross-functional teams to diagnose issues in both Dry and Wet bumping, and drive DOE-based improvements.
You will lead data analysis to detect yield trends, implement continuous improvement initiatives, and manage customer-driven BKM activities as you transition designs from NPI to mass production.
Focus on process yield engineering and bump process integration. Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (both Dry and Wet), including the proposal and execution of Design of Experiments (DOEs)
Responsible to look into data analysis for yield and detect trend
Execute CIP (Continuous Improvement Program) or project handling that contributes yield & cost efficiency improvement
Review and propose updates to calculated Statistical Process Control (SPC) limits to improve product quality and ensure process stability
Take ownership of customer technical inquiries, perform detailed spec reviews, and lead the implementation of requirements for product offload transition from New Product Introduction (NPI) to mass production
Overall coordinator of customer's initiated BKM exercise