Senior/Engineer - AOI,Litho, Plating,Wet Etch,Pick & Place

STATS ChipPAC Pte. Ltd.; Região Norte; Presencial; BRL 120 000 - 150 000; Tempo integral

Resumo da oferta

STATS ChipPAC Pte. Ltd. is seeking an engineer to support and improve manufacturing processes in AOI, Lithography, Plating, Wet Etch, or Pick & Place areas.

You will drive process optimization, yield improvement, quality enhancement, cost reduction, and equipment performance to meet customer requirements. The role emphasizes collaboration with Production, Quality, Equipment, Maintenance, and Process Engineering teams, along with developing documentation and participating in audits and

Qualificações

• Bachelor's Degree in Engineering or related disciplines is required.
• 2–5 years of semiconductor manufacturing experience for Engineer level; more for Senior Engineer.
• Knowledge of semiconductor assembly, packaging, or wafer fabrication processes is advantageous.
• Strong analytical, problem-solving, and statistical analysis skills.
• Good communication and teamwork skills.
• Able to work in a fast-paced manufacturing environment.

Responsabilidades

• Monitor, control, and improve manufacturing processes to achieve quality, yield, productivity, and cycle time targets.
• Analyze process and equipment performance data, identify issues, and implement corrective and preventive actions.
• Lead process qualification, characterization, and continuous improvement projects.
• Support new product introduction (NPI), process transfers, and technology deployment activities.
• Conduct root cause analysis for process deviations, quality issues, customer complaints, and yield excursions.
• Collaborate with Production, Quality, Equipment, Maintenance, and Process Engineering teams to resolve manufacturing challenges.
• Develop and maintain process documentation, work instructions, specifications, and FMEA/control plans.
• Drive cost reduction, scrap reduction, and productivity improvement initiatives.
• Ensure compliance with quality, environmental, health, safety, and customer requirements.
• Provide technical guidance and training to technicians and operators.
• Support audits, customer visits, and process-related reports as required.

Conhecimentos

Analytical skills

Problem solving

Communication skills

Teamwork

Ability to work in fast-paced env

Formação académica

Bachelor's Degree in Engineering

Ferramentas

Statistical analysis software

Descrição da oferta de emprego

Job Summary

Responsible for supporting and improving manufacturing processes within the assigned semiconductor assembly and test area (AOI, Lithography, Plating, Wet Etch, or Pick & Place). Drive process optimization, yield improvement, quality enhancement, cost reduction, and equipment performance to achieve operational excellence and customer requirements.

Key Responsibilities

• Monitor, control, and improve manufacturing processes to achieve quality, yield, productivity, and cycle time targets.

• Analyze process and equipment performance data, identify issues, and implement corrective and preventive actions.

• Lead process qualification, characterization, and continuous improvement projects.

• Support new product introduction (NPI), process transfers, and technology deployment activities.

• Conduct root cause analysis for process deviations, quality issues, customer complaints, and yield excursions.

• Collaborate with Production, Quality, Equipment, Maintenance, and Process Engineering teams to resolve manufacturing challenges.

• Develop and maintain process documentation, work instructions, specifications, and FMEA/control plans.

• Drive cost reduction, scrap reduction, and productivity improvement initiatives.

• Ensure compliance with quality, environmental, health, safety, and customer requirements.

• Provide technical guidance and training to technicians and operators.

• Support audits, customer visits, and process-related reports as required.

Requirements

• Bachelor's Degree in Engineering or related disciplines.

• Minimum 2-5 years of relevant semiconductor manufacturing experience for Engineer level; more experience preferred for Senior Engineer level.

• Knowledge of semiconductor assembly, packaging, or wafer fabrication processes will be an advantage.

• Strong analytical, problem-solving, and statistical analysis skills.

• Good communication and teamwork skills.

• Able to work in a fast-paced manufacturing environment.