Etching Process Engineer (Wafer Bumping)

mnosys sdn bhd; Região Norte; On-site; BRL 134,000 - 201,000; Full time

Job summary

mnosys sdn bhd is seeking an Etching Process Engineer focused on wafer bumping to develop, qualify, and maintain wet etch, clean, and stripping processes for semiconductor fabrication and advanced packaging. You will optimize process parameters to hit target dimensions and surface cleanliness while monitoring health with SPC and conducting DOE studies.

Ideal candidates have a chemical engineering or related background with 2+ years in semiconductor manufacturing, strong problem-solving, and

Qualifications

• Experience in semiconductor manufacturing, preferably wet etch, cleaning, stripping, plating, or wafer-level packaging.
• Knowledge of DOE, SPC, FMEA, CAPA, and statistical data analysis tools.
• Familiarity with wet process equipment and chemical management procedures.

Responsibilities

• Develop, qualify, and maintain wet etch, clean, and stripping processes for wafer fabrication and packaging.
• Optimize process parameters to meet critical dimensions and surface cleanliness targets.
• Monitor process health via SPC and implement corrective actions when deviations occur.
• Investigate yield excursions and defects using root-cause analysis.
• Design and execute DOE experiments to improve performance and reduce costs.
• Collaborate with Equipment, Production, Quality, Product Engineering, and R&D teams.
• Support NPI, process transfers, and technology development activities.
• Evaluate and qualify new chemicals, materials, and process technologies.
• Prepare documentation including specs, work instructions, FMEA, control plans.

Skills

Analytical skills

SPC

FMEA

CAPA

Education

Bachelor's degree in Chemical Engineering

Tools

JMP

Minitab

Wet benches

Delivery systems

Job description

Etching Process Engineer (Wafer Bumping)

Develop, qualify, and maintain wet etch, clean, and stripping processes for semiconductor wafer fabrication and advanced packaging applications. Optimize process parameters to achieve target specifications for critical dimensions, surface cleanliness, and defect performance.

Key responsibilities

• Develop, qualify, and maintain wet etch, clean, and stripping processes for semiconductor wafer fabrication and advanced packaging applications
• Optimize process parameters to achieve target specifications for critical dimensions, surface cleanliness, and defect performance
• Monitor process health through Statistical Process Control (SPC) and implement corrective actions when deviations occur
• Investigate yield excursions, defects, and process abnormalities using root cause analysis methodologies
• Design and execute experiments (DOE) to improve process performance, increase yield, and reduce manufacturing costs
• Collaborate with Equipment, Production, Quality, Product Engineering, and R&D teams to resolve technical issues and support production goals
• Support new product introductions (NPI), process transfers, and technology development activities
• Evaluate and qualify new chemicals, materials, and process technologies
• Prepare and maintain process documentation, including specifications, work instructions, FMEA, control plans, and qualification reports
• Ensure compliance with Environmental, Health, and Safety (EHS) standards, chemical management procedures, and waste disposal regulations

About you

• Degree in Chemical Engineering, Materials Science, Chemistry, Semiconductor Engineering, or a related discipline
• Minimum 2 years of experience in semiconductor manufacturing, preferably in wet etch, cleaning, stripping, plating, or wafer-level packaging processes
• Strong understanding of semiconductor process integration and wet chemical processing
• Knowledge of chemical compatibility, contamination control, and surface preparation techniques
• Experience with DOE, SPC, FMEA, CAPA, and statistical data analysis tools such as JMP or Minitab
• Familiarity with wet process equipment, automated wet benches, and chemical delivery systems
• Strong analytical, troubleshooting, and problem-solving skills