Principal Engineer / MTS – Dry Etch (NAND Semiconductor)

The GMP Group; Região Norte; In loco; BRL 450.000 - 630.000; Tempo pieno

Descrizione del lavoro

The GMP Group is seeking an experienced Principal Engineer / MTS in Dry Etch to advance NAND process development and next‑generation semiconductor technology. You will drive high aspect ratio etching, profile control and CD management while collaborating with cross‑functional teams.

You will apply advanced analytics, statistical modelling and AI tools to accelerate process development and work with equipment suppliers to qualify new plasma chemistries and technologies.

Competenze

• Master's or PhD in Engineering, Materials Science, Physics, Chemistry or related field.
• 7–10+ years of semiconductor process development experience.
• Hands-on expertise in ICP/CCP plasma etch / Dry Etch.
• Strong knowledge of plasma etch equipment, plasma-surface interaction, etch chemistry and profile control.
• Experience with advanced semiconductor / NAND process development.
• Experience with high aspect ratio etching, pattern transfer and/or selective etching is highly preferred.
• Familiarity with AI/ML, statistical modelling, data analytics or process automation is advantageous.
• Strong technical leadership, problem-solving and communication skills.
• Experience mentoring engineers or leading technical projects/teams is preferred.

Mansioni

• Develop and optimize advanced Dry Etch / Plasma Etch processes for NAND technology.
• Drive process development involving high aspect ratio etching, selective etch, profile control and CD management.
• Evaluate new plasma chemistries, process technologies and equipment/hardware.
• Develop and qualify advanced dry etch processes to improve performance, yield and manufacturability.
• Work closely with Process Integration, Thin Films, Wet Etch, Lithography, CMP, Diffusion and Device teams.
• Apply advanced analytics, statistical modelling and digital/AI tools to support process development.
• Provide technical leadership and collaborate with equipment/material suppliers.

Conoscenze

Dry Etch

Plasma Etch (ICP/CCP)

Process Development

Leadership

Data Analytics

AI/ML

Formazione

Master's degree

PhD

Strumenti

ICP/CCP Plasma Etch Equipment

Descrizione del lavoro

About the role

We are looking for an experienced Principal Engineer / Member of Technical Staff (MTS) – Dry Etch to support advanced NAND process development and next-generation semiconductor technology.

Key responsibilities

• Develop and optimize advanced Dry Etch / Plasma Etch processes for NAND technology.
• Drive process development involving high aspect ratio etching, selective etch, profile control and CD management.
• Evaluate new plasma chemistries, process technologies and equipment/hardware.
• Develop and qualify advanced dry etch processes to improve performance, yield and manufacturability.
• Work closely with Process Integration, Thin Films, Wet Etch, Lithography, CMP, Diffusion and Device teams.
• Apply advanced analytics, statistical modelling and digital/AI tools to support process development.
• Provide technical leadership and collaborate with equipment/material suppliers.

About you

• Master's / PhD in Engineering, Materials Science, Physics, Chemistry or related discipline.
• Preferably 7–10+ years of relevant semiconductor process development experience.
• Strong hands-on expertise in ICP/CCP plasma etch / Dry Etch.
• Strong knowledge of plasma etch equipment, plasma-surface interaction, etch chemistry and profile control.
• Experience in advanced semiconductor / NAND process development.
• Experience with high aspect ratio etching, pattern transfer and/or selective etching is highly preferred.
• Familiarity with AI/ML, statistical modelling, data analytics or process automation is advantageous.
• Strong technical leadership, problem-solving and communication skills.
• Experience mentoring engineers or leading technical projects/teams is preferred.