Postdoc: Topological Semimetals for Next-Gen Interconnects

Imec; Vlaams-Brabant; Remote; EUR 42.000 - 64.000; Vollzeit

Zusammenfassung

imec, one of the world’s leading nanoelectronics research centers, invites applications for a Post-doctoral Researcher in Topological Semimetals for Advanced Interconnects. You will develop thin‑film deposition, characterize properties, and contribute to interconnect integration in a highly multidisciplinary team in Leuven, Belgium.

You will collaborate across deposition, characterization and integration teams, present at conferences, and publish in high‑impact journals; English communication is

Qualifikationen

• Strong background in thin‑film processing and materials characterization.
• Experience with topological materials is a plus.
• Good communication skills in English, both written and spoken.

Aufgaben

• Develop, optimize, and perform thin-film deposition of various topological semimetals with nanoscale thickness control.
• Conduct comprehensive physical and structural characterization to relate processing, microstructure, and transport properties.
• Process test vehicles and prototype structures for electrical evaluation of material behavior.
• Collaborate with deposition, characterization, and integration teams in a multidisciplinary R&D environment.
• Communicate progress through internal updates, interactions with partners, and publications.

Kenntnisse

Thin-film processing

Materials characterization

English communication

Team collaboration

Ausbildung

PhD in physics, materials science, electrical engineering

Jobbeschreibung

imec, one of the world’s leading nanoelectronics research centers, invites applications for a Post-doctoral Researcher in Topological Semimetals for Advanced Interconnects. You will develop thin‑film deposition, characterize properties, and contribute to interconnect integration in a highly multidisciplinary team in Leuven, Belgium.

You will collaborate across deposition, characterization and integration teams, present at conferences, and publish in high‑impact journals; English communication is