Pioneering 3D Interconnects R&D Lead

Imec; Vlaams-Brabant; Remote; EUR 90,000 - 130,000; Full time

Job summary

IMEC in Leuven, Belgium, seeks a 3D Interconnects R&D Project Leader to guide a multidisciplinary team from concept through validation for advanced 3D interconnect devices. You will align with FAB managers, resource planning and external customers to ensure timely, high-quality delivery.

You will lead technically and operationally, fostering collaboration, innovation, and continuous improvement while managing showstoppers and escalation when needed.

Qualifications

• PhD or MSc in microelectronics, electrical engineering, physics, or related field.
• Minimum 5 years of semiconductor experience (Process, Integration, Device, Reliability, or Design).
• Experience with Compute technologies (Logic, 3D, Nano-interconnect) is a must.
• 3D interconnect knowledge and integration flows is an asset.
• Industrial experience as an R&D project manager or team leader is advantageous.

Responsibilities

• Lead the team technically and operationally to develop devices for 3D interconnect applications from design to validation.
• Coordinate with external customers and IMEC R&D strategy to demonstrate and validate technology.
• Monitor resources and performance, manage changes, and escalate issues with proposed solutions.
• Regularly report to the project customer and maintain a strong link with their team.

Skills

Project leadership

Customer orientation

Education

PhD or MSc in microelectronics

Job description

IMEC in Leuven, Belgium, seeks a 3D Interconnects R&D Project Leader to guide a multidisciplinary team from concept through validation for advanced 3D interconnect devices. You will align with FAB managers, resource planning and external customers to ensure timely, high-quality delivery.

You will lead technically and operationally, fostering collaboration, innovation, and continuous improvement while managing showstoppers and escalation when needed.