Post-doctoral Researcher Topological Semimetals for Advanced Interconnects

Imec; Vlaams-Brabant; Remote; EUR 42,000 - 64,000; Full time

Job summary

imec, one of the world’s leading nanoelectronics research centers, invites applications for a Post-doctoral Researcher in Topological Semimetals for Advanced Interconnects. You will develop thin‑film deposition, characterize properties, and contribute to interconnect integration in a highly multidisciplinary team in Leuven, Belgium.

You will collaborate across deposition, characterization and integration teams, present at conferences, and publish in high‑impact journals; English communication is

Qualifications

• Strong background in thin‑film processing and materials characterization.
• Experience with topological materials is a plus.
• Good communication skills in English, both written and spoken.

Responsibilities

• Develop, optimize, and perform thin-film deposition of various topological semimetals with nanoscale thickness control.
• Conduct comprehensive physical and structural characterization to relate processing, microstructure, and transport properties.
• Process test vehicles and prototype structures for electrical evaluation of material behavior.
• Collaborate with deposition, characterization, and integration teams in a multidisciplinary R&D environment.
• Communicate progress through internal updates, interactions with partners, and publications.

Skills

Thin-film processing

Materials characterization

English communication

Team collaboration

Education

PhD in physics, materials science, electrical engineering

Job description

Post-doctoral Researcher Topological Semimetals for Advanced Interconnects

The successful candidate will explore the fundamental properties and integration potential of these emerging materials and assess their suitability for advanced interconnect applications.

What you will do

As a postdoctoral researcher in topological semimetals, you will be responsible for the following:

• Develop, optimize, and perform thin‑film deposition of various topological semimetals with nanoscale thickness control.
• Conduct comprehensive physical and structural characterization - such as electrical, morphological, and compositional analysis - to establish the relationships between processing, microstructure, and transport properties.
• Process test vehicles and prototype structures enabling in‑depth electrical evaluation of material behaviour.
• Work closely with imec’s materials deposition, characterization, integration teams, contributing to a highly interdisciplinary R&D environment.
• Apply creative and critical thinking to overcome scientific and technological challenges and proactively support colleagues across imec’s collaborative research ecosystem.
• Communicate progress through internal project updates, interactions with industrial and academic partners, presentations at leading international conferences, and publications in high‑impact journals.

Growth and characterisation activities are primarily carried out in imec’s M&I lab facilities.

What we do for you

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.

Who you are

• PhD in physics, materials science, electrical engineering, or a related discipline.
• Strong background in thin‑film processing and materials characterization; experience with topological materials is a plus.
• Ideally, you already have basic knowledge about interconnect metallization for advanced interconnects and the associated challenges.
• Ability to think beyond conventional approaches and drive scientific innovation.
• Enthusiastic and creative team player with strong networking, communication and reporting skills who likes to work in a multicultural researcher team.
• Strong focus on quality for your deliverables and development progress and set high standards in everything you do with a strong attention to details.
• Good communication skills in English, both written and spoken.