R&D Test Engineer – 3D IC Integration & Automation

Imec; Vlaams-Brabant; Sur place; EUR 60 000 - 90 000; Plein temps

Résumé du poste

Imec in Leuven, Belgium, is seeking an R&D Test Engineer for 3D integration and interconnect characterization and automation. You will develop electrical characterization methods, design DoEs, and automate tests across wafer-level structures, collaborating with process, integration, and CAD teams to translate questions into experiments.

You will work with researchers and engineers to improve measurement throughput, apply AI where helpful, and present results to imec partners.

Qualifications

• Experience in electrical characterization and semiconductor testing.
• Strong analytical mindset and ability to work with multidisciplinary teams.
• Excellent communication and documentation skills.
• Fluent in written and spoken English.
• Ability to work independently while collaborating with other teams.

Responsabilités

• Definition and optimization of DoEs for 3D integration and interconnect characterization.
• Execute wafer-level measurements and interpret anomalies.
• Collaborate with process, integration and CAD teams to define test requirements.
• Automate measurement workflows to improve throughput and reproducibility.
• Present high-quality results to imec partners and publish findings when applicable.
• Share expertise and support knowledge transfer within the team.

Connaissances

Electrical characterization

Semiconductor testing

Measurement instrumentation

Analytical mindset

Independent working

Communication skills

English proficiency

Team player

Formation

Master's degree in electrical engineering, electronics, physics or related field

PhD welcomed or equivalent practical experience

Outils

Wafer probing equipment

Semiconductor parameter analysers

LCR meters

Electrical test instrumentation

Description du poste

Imec in Leuven, Belgium, is seeking an R&D Test Engineer for 3D integration and interconnect characterization and automation. You will develop electrical characterization methods, design DoEs, and automate tests across wafer-level structures, collaborating with process, integration, and CAD teams to translate questions into experiments.

You will work with researchers and engineers to improve measurement throughput, apply AI where helpful, and present results to imec partners.