Staff Engineer, CPB Simulation & Packaging Innovation

Infineon Technologies; Villach; Vor Ort; EUR 70.000 - 110.000; Vollzeit

Zusammenfassung

Infineon Technologies Austria in Villach seeks an engineer to develop and support simulation methodologies, design flows, and tool environments for CPB co-design in a Linux-based HPC setting. You will drive improvements in electromagnetic, thermal and multiphysics analysis for semiconductor package and system development.

Join a global team delivering simulation-driven design for advanced packaging. You will own the CPB co-design environment, consult on projects worldwide, and collaborate across

Qualifikationen

• Degree in Electrical Engineering, Microelectronics, Physics, Computational Engineering, Mechanical Engineering, or related technical field.
• 4+ years in semiconductor package development, simulation, or related engineering.
• Strong background in electromagnetic, thermal, or multiphysics simulation for package/system development.
• Hands-on with industry-standard simulators such as Synopsys/Ansys, Cadence, Siemens, Keysight, COMSOL.
• Proven track record in developing and deploying simulation methodologies and engineering workflows.
• Solid Linux knowledge and programming skills (Python, bash, MATLAB, Perl).
• Fluent English; German a plus; strong analytic and customer-oriented mindset.
• Experience with ML/AI tools for design or simulation is advantageous.

Aufgaben

• Develop and support simulation methodologies, design flows, and tool environments for CPB co-design in Linux-based HPC environment.
• Drive and improve methodologies for electromagnetic, thermal and multiphysics analysis for semiconductor package and system development.
• Own and maintain the simulation environment within the CPB Co-Design Flow & Methodology team and provide consulting to projects worldwide.
• Enable simulation-driven design and verification for advanced packaging technologies including SiP, heterogeneous integration, 2.5D/3D solutions.
• Collaborate with Business Lines, Design Systems, and external partners to address simulation needs and develop engineering solutions.
• Lead technology evaluations, benchmarks, automation initiatives, and knowledge sharing to improve capabilities and productivity.

Kenntnisse

CPB Co-Design

Electromagnetic

Thermal simulation

Multiphyysics

Python

Linux

ML/AI tools

Communication skills

English fluent

Ausbildung

Electrical Engineering

Microelectronics

Physics

Computational Engineering

Mechanical Engineering

Tools

Synopsys/Ansys

Cadence

Siemens

Keysight

COMSOL

Linux scripting

Jobbeschreibung

Infineon Technologies Austria in Villach seeks an engineer to develop and support simulation methodologies, design flows, and tool environments for CPB co-design in a Linux-based HPC setting. You will drive improvements in electromagnetic, thermal and multiphysics analysis for semiconductor package and system development.

Join a global team delivering simulation-driven design for advanced packaging. You will own the CPB co-design environment, consult on projects worldwide, and collaborate across