Yield-Driven Process Integration Engineer | Tech Transfer

Micron Technology; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time off

Paid holidays

Paid family leave

Benefits Guide

Job summary

Micron Technology in Idaho is seeking a FAB Engineer 3 to conduct root cause analysis and drive device yield improvements in a fast-paced manufacturing environment. The role emphasizes DOE work, process capability, and collaboration with the process team to reduce costs and enhance reliability.

The candidate will participate in tech transfer workshops, support 20% international travel, and contribute to next‑generation device performance while sustaining line stability and device quality.

Qualifications

• Experience with DRAM/FLASH memory in high‑volume FAB environments.
• Yield ramp, cost reduction and quality improvement focus in semiconductor fabs.
• Knowledge of device physics, transistor operation, scaling and reliability.
• CMOS and device characterization experience.
• Experience writing and analyzing SWR and DOE experiments.
• Process integration work with transfer documents (PRD), module ownership and technology ramp.
• SPC knowledge to maintain and troubleshoot module health.
• Structured problem solving using Kepner‑Tregoe, Fishbone, DMAIC, 8D or model‑based methods.

Responsibilities

• Conduct root cause investigation and failure analysis in a time‑sensitive environment.
• Drive best‑in‑class yield, low cost, and quality.
• Improve process capability and margin by running DOE in collaboration with the process team.
• Monitor trends and sustain line stability.
• Improve device performance by addressing top detractors to improve yield and reliability.
• Run workshops on next‑generation devices during tech transfer.
• Position requires 20% international travel.

Skills

DRAM/Flash

FAB experience

Yield improvement

Device physics

CMOS/Characterization

DOE & SWR

Process integration

SPC knowledge

Structured problem solving

Job description

Micron Technology in Idaho is seeking a FAB Engineer 3 to conduct root cause analysis and drive device yield improvements in a fast-paced manufacturing environment. The role emphasizes DOE work, process capability, and collaboration with the process team to reduce costs and enhance reliability.

The candidate will participate in tech transfer workshops, support 20% international travel, and contribute to next‑generation device performance while sustaining line stability and device quality.