Precision Electronics Technician: Wire Bonding & Micro-Assembly

Teledyne Technologies Incorporated; Lewisburg (KY); On-site; USD 32,000 - 45,000; Full time

Job summary

Teledyne Technologies Incorporated is seeking individuals to join a team that supports production and engineering through precision electronic assembly, micro-electronics work, and wire bonding under a microscope.

Under close to moderate supervision, you will build PCAs, modules, and subassemblies, perform soldering, inspections, and maintain accurate production records, while following safety and IPC standards.

Qualifications

• High school diploma or equivalent; technical training preferred.
• 0-3 years of experience in electronic assembly, micro-electronics, or wire bonding.
• Experience with microscope work and fine motor skills required.
• Basic understanding of electronic components and schematics.
• Ability to perform soldering and micro-assembly tasks to standard.

Responsibilities

• Assemble electronic and electro-mechanical subassemblies per drawings and instructions.
• Perform precision micro-electronics assembly, including wire bonding under a microscope.
• Interpret schematics, BOMs, and manufacturing instructions to determine components and processes.
• Install and connect components onto PCBs and substrates.
• Perform soldering and de-soldering on through-hole and surface-mount components.
• Set up, operate, and maintain wire bonding equipment.
• Inspect wire bonds and micro-electronic assemblies under microscopes.
• Conduct in-process inspections and ensure quality standards are met.
• Maintain production records and documentation.
• Follow safety and ESD procedures.

Skills

Microscope work

Fine motor skills

Attention to detail

Team collaboration

Education

High school diploma or equivalent

Technical training preferred

Tools

Wire bonding equipment

Job description

Teledyne Technologies Incorporated is seeking individuals to join a team that supports production and engineering through precision electronic assembly, micro-electronics work, and wire bonding under a microscope.

Under close to moderate supervision, you will build PCAs, modules, and subassemblies, perform soldering, inspections, and maintain accurate production records, while following safety and IPC standards.