Manufacturing Technician - Wire Bonding (Manual Wedge)

FHLB Des Moines; Lawrence (MA); On-site; USD 30,000 - 48,000; Full time

Benefits offered by this job

Health benefits from day one

RSUs (restricted stock)

Quarterly bonus

ESP P program

Job summary

Microchip Technology Inc. is seeking a detail-oriented Manufacturing Technician for its Discrete Products Group. The role focuses on wire bonding within a high-precision semiconductor environment.

You will perform bonding, testing, and process improvements, collaborating with engineering and QA to ensure quality while adhering to strict cleanroom protocols.

Qualifications

• High school diploma or equivalent; technical degree preferred.
• Minimum 2 years in wire bonding or semiconductor manufacturing.
• Proficiency with automated wire bonding machinery and manual wire bonding.
• Read and interpret technical drawings and process specs.
• Able to use a computer for job activities.
• Excellent manual dexterity and visual capability.
• Experience using tweezers, vacuum pencils, etc.
• Good communication skills in a fast-paced, team environment.

Responsibilities

• Perform manual wire bonding tasks using microscopes and bonding tools.
• Inspect and test wire bonds for quality and specs compliance.
• Set up wire bond equipment, change tools and wires, troubleshoot issues.
• Maintain accurate production data, process adjustments, and equipment maintenance.
• Collaborate with engineering and QA to improve wire bonding processes.
• Adhere to cleanroom protocols and safety guidelines.
• Participate in continuous improvement and training programs.
• Assist in training new technicians and support staff.
• Perform other tasks and support various projects as needed.

Skills

Wire bonding

Semiconductor manufacturing

Automated wire bonding

Manual wire bonding

Microelectronics

Technical drawings

Computer literacy

Dexterity

Attention to detail

Teamwork

Communication

Education

High school diploma

Electronics/microelectronics certification

Tools

Wire bonding equipment

Microscopes

Bonding tools

Job description

About Microchip

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc. People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence. Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation.

Position

Microchip company, Discrete and Integrated Solutions Group (DISG) offers one of the industry's most comprehensive power and RF/microwave discrete semiconductor product portfolios. The DISG encompasses two business units, the Power Discrete & Modules BU and the RF/Microwave Discreet BU. Markets the PDM & RF/MW discrete BU's address include: alternative energy, industrial, medical, defense, commercial aviation, communications, embedded systems, motor control, power solutions, sensors and security. Microchip is planning to fill the following position with a talented, creative and motivated individual. We are seeking a detail-oriented and technically skilled Manufacturing Technician to join our Discrete Products Group (DPG) component manufacturing department.

Job Responsibilities

• Perform manual wire bonding tasks as needed, utilizing microscopes and bonding tools.
• Inspect and test wire bonds to ensure quality and compliance with specifications.
• Perform wire bond equipment setup including tool changes, wire changes, and troubleshoot wire bond equipment and process issues, implementing corrective actions to minimize downtime.
• Maintain accurate records of production data, process adjustments, and equipment maintenance.
• Collaborate with engineering and quality assurance teams to improve wire bonding processes and product quality.
• Adhere to cleanroom protocols and safety guidelines to maintain a safe and efficient work environment.
• Participate in continuous improvement initiatives and training programs to enhance technical skills and knowledge.
• Assist in the training of new technicians and support staff as required.
• Perform other tasks and assist with various projects as needed.

Requirements and Qualifications

• High school diploma or equivalent; technical degree or certification in electronics, microelectronics, or a related field is preferred.
• Minimum of 2 years of experience in a wire bonding or semiconductor manufacturing role.
• Proficiency with automated wire bonding machinery and manual wire bonding techniques.
• Strong understanding of microelectronics and the ability to work with delicate components.
• Ability to read and interpret technical drawings and process specifications.
• Ability to navigate and utilize a computer to perform job activities.
• Excellent manual dexterity and hand-eye coordination.
• Excellent visual capability to work with extremely small die, without magnification devices.
• Experience using tweezers, vacuum pencils, etc.
• Strong problem-solving skills and attention to detail.
• Ability to work in a fast-paced, team-oriented environment.
• Good communication skills, both written and verbal.

U.S. Export Controls Requirements

This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).

Travel Time

No Travel

Physical Attributes

• Carrying
• Climbing
• Crouching
• Feeling
• Foot Controls
• Handling
• Hearing
• Kneeling
• Lifting
• Noise and/or vibration
• Other
• Pulling
• Pushing
• Reaching
• Seeing
• Stooping
• Talking
• Works Alone
• Works Around Others

Physical Requirements

Able to lift, push, pull 25 lbs; carry 15 lbs; sit 10%; stand 60%; walk 40%; must be able to perform activities that include stooping, reaching, handling, hearing, talking, seeing, working alone and working around others.

Pay Range

The hourly pay range for this position, which could be performed in the US, is $22.50 - $35.00.* *Range is dependent on numerous factors including job location, skills and experience.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive base pay, restricted stock units, and quarterly bonus payments. In addition to these components, our package includes health benefits that begin day one, retirement savings plans, and an industry leading ESPP program with a 2 year look back feature. Find more information about all our benefits at the link below:

Equal Opportunity and Diversity Statement

Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law. For more information on applicable equal employment regulations, please refer to the Know Your Rights: Workplace Discrimination is Illegal Poster.