Wire Bonding Specialist – Advanced Manufacturing Production Operator

APR Consulting, Inc.; Scottsdale (AZ); On-site; USD 29,000 - 39,000; Full time

Job summary

APR Consulting, Inc. is seeking a Wire Bonding Specialist – Advanced Manufacturing Production Operator for a Scottsdale, AZ on-site assignment supporting defense and aerospace programs.

You will perform precision wire bonding and die bonding on microelectronic devices under microscopes, using manual and automated equipment with fine-pitch accuracy. The role supports prototype, pre‑production, and production builds, ensuring quality workmanship and strict documentation in a controlled

Qualifications

• High School Diploma or equivalent required; minimum 4 years of relevant experience.
• Must be eligible for access to classified information; U.S. citizenship required.
• On-site in Scottsdale, AZ; First Shift; Contract length 12-24 months (potential for direct hire)

Responsibilities

• Perform precision wire bonding operations on microelectronic, hybrid, and semiconductor assemblies.
• Perform die attach/die bonding processes using approved manufacturing procedures.
• Operate wire bonding equipment and associated tooling.
• Work under microscopes to complete fine-pitch assembly and inspection tasks.
• Interpret engineering drawings, assembly instructions, travelers, and manufacturing work instructions.
• Perform component installation, hand soldering, and microelectronic assembly operations.
• Conduct visual inspection and verification of bonded assemblies in accordance with workmanship standards.
• Perform electrical testing, continuity testing, and inspection activities.
• Support prototype, pre-production, and production hardware builds.
• Document manufacturing activities and complete production paperwork accurately.
• Enter information into manufacturing execution systems and work order management systems.

Skills

Wire bonding operations

Die bonding

Microscope-based assembly

Fine-pitch assembly

Inspection and testing

Quality documentation

Hand soldering

Reading and interpreting drawings

Manufacturing execution systems

Education

High School Diploma or equivalent

Tools

Wire bonding equipment

Microscopes

Inspection tools

Job description

Our DoD/Aerospace Client is looking to fill an Wire Bonding Specialist – Advanced Manufacturing Production Operator position supporting mission-critical defense and aerospace programs. This role offers the opportunity to contribute to the fabrication, assembly, integration, testing, and refurbishment of advanced electronic and mechanical systems in a production and manufacturing environment.

The position is based in Scottsdale, Arizona and is on-site.

Location: Scottsdale, AZ
Position: Wire Bonding Specialist – Advanced Manufacturing Production Operator
Contract Length: 12-24 Months (Potential for Direct Hire)
Pay: $24.99/hour
Education/Experience: High School Diploma or equivalent required; minimum 4 years of relevant experience
Schedule: First Shift Clearance Requirement: Must be eligible for access to classified information; U.S. citizenship required

Wire Bonding Specialist – Advanced Manufacturing Production Operator
Position Overview

Our Client is seeking an experienced Wire Bonding Specialist / Advanced Manufacturing Production Operator to support the assembly and production of highly reliable microelectronic and hybrid assemblies used in advanced defense and aerospace systems.

In this role, you will perform precision wire bonding and die bonding operations on microelectronic devices, modules, and assemblies in a controlled manufacturing environment. The ideal candidate will have hands‑on experience with manual and automated wire bonding equipment, microscope‑based assembly, fine‑pitch work, and inspection activities requiring exceptional attention to detail.

This position plays a critical role in supporting prototype, pre‑production, and full‑rate manufacturing programs where quality, precision, and workmanship are essential to mission success.

Primary Responsibilities

• Perform precision wire bonding operations on microelectronic, hybrid, and semiconductor assemblies
• Perform die attach/die bonding processes using approved manufacturing procedures
• Operate wire bonding equipment and associated tooling
• Work under microscopes to complete fine‑pitch assembly and inspection tasks
• Interpret engineering drawings, assembly instructions, travelers, and manufacturing work instructions
• Perform component installation, hand soldering, and microelectronic assembly operations
• Conduct visual inspection and verification of bonded assemblies in accordance with workmanship standards
• Perform electrical testing, continuity testing, and inspection activities
• Support prototype, pre‑production, and production hardware builds
• Document manufacturing activities and complete production paperwork accurately
• Enter information into manufacturing execution systems and work order management systems