Intel Foundry Module Development Engineer – Advanced Wet Etch and Cleans

Intel Corporation; Hillsboro (OR); Hybrid; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health insurance

Retirement plan

Relocation assistance

Job summary

Intel Foundry TD seeks a Wet Etch Module Development Engineer with a PhD in a related field to lead DOE-driven development of novel wet etch, cleaning, and surface treatment processes for next‑gen transistor architectures. You will collaborate with global suppliers and integrate CFD, kinetics modeling, and data science to accelerate discovery and yield improvements.

The role offers a hybrid work model, access to state‑of‑the‑art 300mm facilities, and opportunities to contribute to patentable IP

Qualifications

• Ph.D. required or expected within 12 months.
• 2+ years hands-on experimental research in wet chemical synthesis/etching, electrochemistry, or cleanroom processing.
• Strong knowledge of chemical kinetics and interfacial surface phenomena.

Responsibilities

• Design and execute DOEs to invent and validate wet etch and clean processes for advanced transistor architectures.
• Collaborate with equipment suppliers to optimize single‑wafer and batch wet processing hardware.
• Apply CFD, chemical kinetics, and data science to screen formulations and improve yields.
• Translate chemical phenomena into patentable IP and proprietary wet processing solutions.
• Scale lab processes to 300mm fab environments using CE methodologies.

Skills

DOE proficiency

Wet etching

Surface chemistry

Python

MATLAB

JMP

Machine learning

Experimental research

Education

Ph.D. in Chemical Engineering, Chemistry, Materials Science and Engineering, Electrochemistry, Mechanical Engineering (Microfluidics/Transport Phenomena), Physics

Tools

Ellipsometry

AFM

SEM/TEM

XPS

FTIR

TXRF

ICP‑MS

Single‑wafer spin hardware

Job description

Job Details: Job Description:

Shape the Atomic Frontier of Semiconductor Innovation At Intel Foundry Technology and Development (TD), we don't just participate in technology development; we engineer physical reality at the angstrom scale. We are seeking visionary, research-driven Ph.D. graduates in Chemical Engineering, Chemistry, Materials Science, Electrochemistry, and Engineering to spearhead the next breakthrough in semiconductor manufacturing. As a Wet Etch Module Development Engineer, you will operate at the intersection of fundamental chemical kinetics, interfacial surface science, and high-volume manufacturing engineering. You will pioneer atomic-layer selective etching, nanoscale surface cleans, supercritical and surface-tension-engineered drying, wet chemical formulations, and advanced single-wafer wet tool architectures to define the future of global computing.

What You Will Do:

• Pioneer Next‑Gen Process Architectures: Formulate and execute rigorous Design of Experiments (DOE) to invent, characterize, and validate novel wet etch, selective removal, and advanced chemical clean processes that power world‑class transistor architectures (RibbonFET/GAA), backside power delivery networks (PowerVia), and high‑density interconnect scaling
• Lead Hardware and Module Co‑Optimization: Collaborate with premier global semiconductor equipment suppliers and specialty chemical vendors to push single‑wafer and batch wet processing capabilities beyond conventional fluid‑dynamic and surface‑tension limits, co‑engineering custom dispense, megasonic, and chamber hardware solutions
• Harness AI and Scientific Computing: Integrate computational fluid dynamics (CFD), chemical kinetics modeling, statistical physics, and data science (Python, MATLAB, JMP, ML frameworks) to accelerate chemical formulation screening, surface defectivity reduction, and line‑yield enhancement
• Drive High‑Impact IP: Translate complex chemical, electrochemical, and surface phenomena into high‑value patents, trade secrets, and proprietary wet processing solutions that sustain Intel Foundry's technological leadership
• Scale Science to Global Manufacturing: Bridge early lab prototypes and coupon‑level studies to 300mm fab‑scale ramp, seamlessly deploying high‑throughput, defect‑free wet processes across Intel's worldwide mega‑fabs using our industry‑leading Copy Exactly (CE) methodology

Why Join Intel Foundry TD?

• Access to Unparalleled Technology: Direct, hands‑on access to the industry's most advanced 300mm cleanroom facilities, state‑of‑the‑art single‑wafer wet processing platforms, and cutting‑edge analytical surface characterization suites
• Academic Rigor Meets Global Impact: The intellectual curiosity and depth of doctoral research combined with the scale, capital resources, and execution speed of an industry leader
• Accelerated Technical Leadership: Direct mentorship and collaboration with Intel Fellows and Senior Principal Engineers on an accelerated path toward technical distinction
• Comprehensive Total Rewards: Top‑tier Ph.D. compensation packages, sign‑on bonuses, annual performance bonuses, Employee Stock Purchase Plan (ESPP), equity/RSU grants, and full relocation assistance

Qualifications:

Minimum Qualifications:

• Ph.D. in Chemical Engineering, Chemistry, Materials Science and Engineering, Electrochemistry, Mechanical Engineering (Microfluidics/Transport Phenomena), Physics, or a closely related discipline (Degree completed or expected within 12 months)
• 2+ years of hands‑on experimental research experience (e.g., doctoral dissertation, advanced wet chemical synthesis/etching, aqueous/non‑aqueous solution chemistry, electrochemistry, surface functionalization, thin‑film interface phenomena, or cleanroom wet bench processing)

Preferred Qualifications:

• Demonstrated deep expertise in chemical reaction kinetics, selective wet etching, interfacial surface chemistry, corrosion/passivation mechanisms, or surfactant‑assisted cleaning/drying mechanisms (e.g., Marangoni drying, supercritical (CO2), Surface modification (SMT))
• Hands‑on experience with advanced thin‑film, surface, and chemical characterization techniques (e.g., Ellipsometry, AFM, SEM/TEM, XPS, contact angle goniometry, FTIR, TXRF, or ICP‑MS)
• Experience with automated fluidic systems, wet processing instrumentation design, single‑wafer spin hardware, or experimental fluid dynamics/mass‑transfer troubleshooting
• Demonstrated experience utilizing Python, MATLAB, JMP, or Machine Learning for design of experiments (DOE), multivariate statistical analysis, or process automation
• Strong publication record, conference presentations, or filed patent applications demonstrating systematic problem‑solving in experimental chemical and materials science

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information

Job Type: College Grad Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on‑site at their assigned Intel site and off‑site.

* Job posting details (such as work model, location or time type) are subject to change.

* ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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