Thermal Solutions Lead for AI Datacenters

Critical Fit Recruiting; Boston (MA); On-site; USD 130,000 - 190,000; Full time

Job summary

Critical Fit Recruiting in the Boston area is seeking a Technical Manager-Thermal for AI datacenters to lead customers through TIM adoption and integration.

You will coordinate internal design, support R&D, and serve as the technical liaison with ODM/OSAT and hyperscalers, translating requirements into actionable work and delivering qualification data.

The role requires 3–7 years in semiconductor packaging, strong communication, and hands-on testing; CAD, X-ray, and FEA familiarity preferred.

Qualifications

• Degree in Mechanical Engineering or related field.
• 3–7 years in semiconductor packaging or related electronics experience.
• Strong ability to translate customer requirements into technical work.
• Experience with thermal testing and reliability standards is a plus.

Responsibilities

• Lead design and development to integrate TIM into customer packages.
• Build/test package mockups and demonstrate design feasibility.
• Document designs for fabrication and coordination with customers.
• Support R&D in system performance improvements.
• Act as primary technical contact for ODM/OSAT and hyperscalers.
• Capture customer requirements and translate into technical specs.
• Prepare technical content to support decisions and qualification processes.
• Support testing trials and coordinate issue resolution with teams.
• Synthesize customer feedback to guide product roadmap.

Skills

Thermal design

Data analysis

Cross-functional leadership

Communication skills

Education

Bachelor’s or Master’s in Mechanical Engineering

Tools

CAD software

FEA modeling

X-ray analysis

Job description

Critical Fit Recruiting in the Boston area is seeking a Technical Manager-Thermal for AI datacenters to lead customers through TIM adoption and integration.

You will coordinate internal design, support R&D, and serve as the technical liaison with ODM/OSAT and hyperscalers, translating requirements into actionable work and delivering qualification data.

The role requires 3–7 years in semiconductor packaging, strong communication, and hands-on testing; CAD, X-ray, and FEA familiarity preferred.