Hybrid Thermal/Mechanical Engineering Intern

Hewlett Packard Enterprise Company; Spring (TX); Híbrido; USD 48.000 - 56.000; Jornada completa

Descripción de la vacante

Hewlett Packard Enterprise is seeking a Thermal/Mechanical Engineering Intern to support design, analysis, testing, and validation of server hardware. You will work with cross-functional engineers on cooling and mechanical solutions for CPUs, GPUs, memory, and power systems, gaining hands-on lab experience.

This hybrid internship requires ~2 days per week in an HPE office in Texas, offering exposure to CAD, CFD, CFD/FEA, and lab testing, with emphasis on safety and documentation.

Formación

• Currently pursuing a bachelor’s or master’s degree in Mechanical or Aerospace Engineering or related technical field.
• Completed coursework in heat transfer, thermodynamics, fluid mechanics, statics, mechanics of materials or mechanical design.
• Ability to apply engineering principles to practical problems and communicate results clearly.
• Basic proficiency with spreadsheets and technical presentations.

Responsabilidades

• Support mechanical and thermal development of rack-mount server platforms and components.
• Design and evaluate heat sinks, fans, air ducts, cold plates, brackets and sheet-metal parts.
• Build and instrument prototypes for thermal, airflow, acoustic, vibration, and mechanical testing.
• Measure temperatures, airflow, pressure, power, and environmental conditions in the lab.
• Execute test plans, maintain records, analyze results, and summarize findings.
• Support workload and stress testing of CPUs, GPUs, DIMMs, drives and power supplies.
• Perform CAD, tolerance analysis, and thermal modeling under guidance.
• Investigate test anomalies with troubleshooting and root-cause methods.

Conocimientos

Heat transfer

Thermodynamics

Fluid mechanics

Statics

Mechanics of materials

Mechanical design

Lab testing

Data presentation

Educación

Bachelors in Mechanical Engineering

Masters in Mechanical Engineering

Aerospace Engineering or related field

Herramientas

CAD

CFD

FEA

Thermal modeling

Tolerance analysis

Data acquisition

Descripción del empleo

Hewlett Packard Enterprise is seeking a Thermal/Mechanical Engineering Intern to support design, analysis, testing, and validation of server hardware. You will work with cross-functional engineers on cooling and mechanical solutions for CPUs, GPUs, memory, and power systems, gaining hands-on lab experience.

This hybrid internship requires ~2 days per week in an HPE office in Texas, offering exposure to CAD, CFD, CFD/FEA, and lab testing, with emphasis on safety and documentation.