Thermal Systems Design Engineer for High-Volume Hardware

Apple; Austin (TX); On-site; USD 90,000 - 130,000; Full time

Job summary

Apple Inc. in Austin, Texas is seeking a highly skilled Mechanical/Design Engineer to dimension and optimize thermal modules, cooling fans, and related assemblies for high-volume consumer products. You will analyze CAD drawings, apply GD&T, and collaborate with module vendors to balance performance and reliability.

The role emphasizes hands-on prototyping, test-data review, and applying first-principles engineering to attach thermal modules to SoCs while maintaining manufacturability and quality.

Qualifications

• Master's degree in Mechanical Engineering, Computer Engineering, or related field and 2 years of experience.
• Experience communicating designs via CAD drawings to external vendors.
• Familiarity with translational methods for high-volume consumer products.
• Knowledge of statics, mechanical structures, GD&T, and Cp/Cpk methodologies.
• Heat transfer and thermal management design experience.
• Design experience with cooling fans, thermal modules, or vapor chambers.

Responsibilities

• Dimension and determine tolerance of engineering drawings for high-volume mass production.
• Review test and measurement data and iterate test definitions for design feasibility.
• Develop and prototype innovative thermal modules and cooling fan concepts.
• Determine methods to attach thermal modules to SoCs to optimize performance and reliability.

Skills

Statics and structures

Geometric Dimensioning & Tolerancing

Thermal management

2D mechanical drawings

Team collaboration

Education

Master's degree in Mechanical or Computer Engineering

Tools

CAD software

Job description

Apple Inc. in Austin, Texas is seeking a highly skilled Mechanical/Design Engineer to dimension and optimize thermal modules, cooling fans, and related assemblies for high-volume consumer products. You will analyze CAD drawings, apply GD&T, and collaborate with module vendors to balance performance and reliability.

The role emphasizes hands-on prototyping, test-data review, and applying first-principles engineering to attach thermal modules to SoCs while maintaining manufacturability and quality.