IC Packaging Engineer

Apple Inc.; Cupertino (CA); Hybrid; USD 150,000 - 225,000; Full time

Benefits offered by this job

Medical & dental coverage

Employee stock programs

Relocation assistance

Job summary

Apple Inc. in Cupertino, California, seeks a Thermal Architect to design and optimize thermal solutions for mobile devices. You will lead CFD and heat transfer analyses across silicon and packaging, collaborating with silicon design, system thermal, and debug teams to ensure robust thermal performance.

A Master’s in Mechanical Engineering and 4+ years of experience are expected. The role offers comprehensive benefits, stock participation, relocation options, and growth opportunities within

Qualifications

• Master's Degree in Mechanical Engineering or related field with 4+ years experience in thermal design.
• Experience applying heat transfer to packaging design across silicon and system levels.
• Experience using CFD to analyze flow and heat transfer in cooling systems.
• Experience implementing thermal models and automating workflows.

Responsibilities

• Architect thermal solutions to improve energy efficiency and performance.
• Run CFD and heat transfer analyses.
• Collaborate with silicon design, system thermal, and debug teams.
• Provide thermal modeling for die and packaging levels.
• Optimize IC design for thermal performance.
• Develop detailed and reduced-order thermal models.
• Analyze simulations to improve product thermal management.

Skills

Heat transfer principles

CFD tools

Python

C++

Thermal modeling

Thermal management

Education

Master's Degree in Mechanical Engineering

Tools

CAD tools

CFD software

Job description

Cupertino, California, United States Hardware

Imagine what you can do here. Apple is a place where extraordinary people gather to do their lives best work. Together we create products and experiences people once couldn't have imagined, and now, can't imagine living without. It's the diversity of those people and their ideas that inspires the innovation that runs through everything we do.

Description

APPLE INC has the following available in Cupertino, California and various unanticipated locations throughout the USA. Architect thermal solutions to address chip energy efficiency and performance scaling. Run Computational Fluid Dynamics (CFD) and heat transfer analysis. Work with cross functional teams on silicon design, system thermal design, and debug issues. Provide thermal modeling solutions to mobile devices at silicon die and semiconductor package levels. Optimize advanced Integrated Circuit (IC) design scheme/floor-planning to ensure good thermal performance. Develop detailed and reduced-order thermal models. Analyze simulation and measurement results to enhance product thermal management. 40 hours/week. At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $150,400 - $225,300/yr and your base pay will depend on your skills, qualifications, experience, and location.PAY & BENEFITS: Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits: https://www.apple.com/careers/us/benefits.html.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

Minimum Qualifications

• Master's Degree or foreign equivalent in Mechanical Engineering or related field and 4 years of experience in the job offered or related occupation.
• Education and/or experience must include:
• Utilizing fundamental heat transfer principles and analytical equations to evaluate and optimize packaging thermal design across silicon and system levels
• Utilizing C++ or Python to implement conductive heat transfer models and automate thermal simulation workflows
• Utilizing CFD tools to analyze flow field and heat transfer in air cooled or liquid cooled systems
• Designing and implementing advanced cooling solution design to maximize thermal performance across product platforms
• Designing and improving packaging architecture to improve maximum sustaining power and thermal efficiency.
• Utilizing CAD tools to design, prototype, and manufacture advanced cooling components and thermal management hardware
• Utilizing two phase heat transfer theory to design and optimize cold plate solutions for high power applications
• Designing and running thermal characteristic tests to measure and validate the thermal response of products under realistic operating conditions.
• Utilizing fluid dynamics principles to optimize pressure drop, flow distribution and coolant flow rate in thermal systems

Preferred Qualifications

• N/A

This position is not subject to the application limits.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant

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Apple accepts applications to this posting on an ongoing basis.