IC Packaging Engineer

Socket.dev; Cupertino (CA); On-site; USD 150,000 - 225,000; Full time

Benefits offered by this job

Medical and dental coverage

Apple stock programs

Tuition reimbursement

Job summary

APPLE INC is seeking a Master’s‑level Mechanical Engineer to architect advanced thermal solutions for cutting‑edge chips in Cupertino, CA. You will run CFD and heat transfer analyses, collaborating with silicon design, packaging teams, and validation engineers to optimize thermal performance across die and package levels.

Responsibilities include developing detailed thermal models, implementing conductive heat transfer simulations in C++/Python, and supporting cross‑functional design reviews.

Qualifications

• Master's Degree in Mechanical Engineering or foreign equivalent.
• Experience applying heat transfer principles to optimize packaging thermal design across silicon and system levels.
• Experience implementing conductive heat transfer models in Python/C++ and automating thermal simulations.

Responsibilities

• Architect thermal solutions to address chip energy efficiency and performance scaling.
• Run CFD and heat transfer analyses for mobile devices at silicon die and package levels.
• Collaborate with cross‑functional teams on silicon design, system thermal design, and debugging thermal issues.
• Develop and refine thermal models and validate them with simulation and measurement data.

Skills

C++

Python

CFD

Heat transfer

Thermal modeling

Two-phase heat transfer

CAD tools

Education

Master's Degree in Mechanical Engineering

Tools

CAD tools

CFD software

Job description

Imagine what you can do here. Apple is a place where extraordinary people gather to do their lives best work. Together we create products and experiences people once couldn't have imagined, and now, can't imagine living without. It's the diversity of those people and their ideas that inspires the innovation that runs through everything we do.

Description

APPLE INC has the following available in Cupertino, California and various unanticipated locations throughout the USA. Architect thermal solutions to address chip energy efficiency and performance scaling. Run Computational Fluid Dynamics (CFD) and heat transfer analysis. Work with cross functional teams on silicon design, system thermal design, and debug issues. Provide thermal modeling solutions to mobile devices at silicon die and semiconductor package levels. Optimize advanced Integrated Circuit (IC) design scheme/floor-planning to ensure good thermal performance. Develop detailed and reduced-order thermal models. Analyze simulation and measurement results to enhance product thermal management. 40 hours/week. At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $150,400 - $225,300/yr and your base pay will depend on your skills, qualifications, experience, and location. PAY & BENEFITS: Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits: https://www.apple.com/careers/us/benefits.html.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

Minimum Qualifications

Master's Degree or foreign equivalent in Mechanical Engineering or related field and 4 years of experience in the job offered or related occupation. Education and/or experience must include: Utilizing fundamental heat transfer principles and analytical equations to evaluate and optimize packaging thermal design across silicon and system levelsUtilizing C++ or Python to implement conductive heat transfer models and automate thermal simulation workflowsUtilizing CFD tools to analyze flow field and heat transfer in air cooled or liquid cooled systemsDesigning and implementing advanced cooling solution design to maximize thermal performance across product platformsDesigning and improving packaging architecture to improve maximum sustaining power and thermal efficiency.Utilizing CAD tools to design, prototype, and manufacture advanced cooling components and thermal management hardwareUtilizing two phase heat transfer theory to design and optimize cold plate solutions for high power applicationsDesigning and running thermal characteristic tests to measure and validate the thermal response of products under realistic operating conditions.Utilizing fluid dynamics principles to optimize pressure drop, flow distribution and coolant flow rate in thermal systems

Preferred Qualifications

N/A