Technical Staff Engineer-Packaging

Analog Group; Arizona; On-site; USD 120,000 - 160,000; Full time

Job summary

A leading provider in embedded control applications is seeking a Senior Power Package Development Engineer in Arizona. The role involves IC package development from design to production, including managing qualification and interfacing with assembly teams. Ideal candidates will have extensive experience, particularly in advanced package design and thermal simulations.

Qualifications

• 12+ years of experience required.
• Ability to comprehend engineering drawings.
• Experience with advanced laminate (BGA) and QFN package design.

Responsibilities

• Oversee IC package development from design to production.
• Manage qualification of new packages and changes.
• Interface with multiple assembly and engineering teams.

Skills

Thermal simulations

Electrical simulations

Problem solving

Mentoring

Communication

Tools

Ansys Workbench

Job description

Our Client is a leading provider of embedded control applications. Their product portfolio comprises a broad spectrum of high-performance linear, mixed-signal, power management, thermal management, radio frequency (RF), timing, safety, security, wired / wireless connectivity devices, as well as microcontrollers and field-programmable gate array (FPGA) products.

Job Description

This position for a Senior Power Package Development Engineer will entail all aspects of IC package development from initial design and performance considerations to package design optimization, determining design rules, selecting and completing package qualification, interface with subcon and internal assembly and reliability resources, and final release to production. The primary business unit requires packaging in power FET packaging, Cu Clip, Cu Pillar Bump, and other lead frame based advanced packages, but may also entail wafer level packaging and potentially laminate package support as well. Responsibilities include the following:
Identify suitable IC package options and perform feasibility studies for all NPI (new product introduction), provide direct interface with multiple assembly sites as well as die design groups, product engineering, marketing and business units.

Ensure early success in package development with substantial modeling and simulation for thermal, mechanical and electrical aspects.
Oversee evaluation and development of new packaging materials and processes.
Manage qualification of new packages or changes to ensure quality and mitigate risk.
Initiate and follow up on assembly build instructions for all engineering builds in U.S. and Asia.
Assist with global cost reduction, standardization and new system implementation projects.

Job Requirements

12+ years of experience.

Ability to comprehend engineering drawings.
Experience with advanced laminate (BGA) and QFN package design and assembly.
Well-developed knowledge of thermal & electrical simulations, ideally Ansys Workbench and related tools.
Superior communication and presentation skills and the ability to lead a small team as needed including mentoring junior engineers.
Ability to problem solve and assist the reliability group on FA’s on assembly related failures.

Knowledge of qualification methods for high power and high current IC’s.
Ability to carry on multiple projects, set time-lines and prioritize projects.
Travel to Asia occasionally to attend technology reviews and resolve subcon issues.
Competence in working with multiple databases, technical acronyms and complex data sets.