Principal Semiconductor Process Development Engineer

Aptino, Inc.; Morgan Hill (CA); On-site; USD 140,000 - 210,000; Full time

Job summary

Aptino, Inc. in Morgan Hill, CA is seeking a Principal Process Development Engineer to lead semiconductor backend assembly and package development for RF Power products.

You will define process specifications and recipes, select materials, upgrade equipment, and drive continuous improvements in quality, yield, reliability and cost. Collaboration with equipment vendors, subcontractors and internal teams is essential.

Qualifications

• 8+ years of experience in semiconductor package and assembly process development.
• Hands-on experience with backend assembly processes such as die attach, die bonding, and lid attach.
• In-depth knowledge of semiconductor backend assembly processes, particularly RF Power packages.
• Experience with FMEA/DFMEA/PFMEA, SPC, Pareto Analysis, Control Charts, 8D, and DOE.
• Strong project management, documentation, communication, and problem-solving skills.

Responsibilities

• Develop and improve backend assembly processes and package technologies for RF Power products.
• Define process specifications, develop process recipes, select materials, and support equipment upgrades.
• Identify potential process, material, and equipment issues and develop effective solutions.
• Drive continuous improvement initiatives focused on quality, process efficiency, reliability, and cost reduction.
• Design and develop customized tooling for high-volume manufacturing equipment.
• Lead verification and qualification activities for new tooling, equipment, and materials.
• Work with equipment vendors, subcontractors, and internal engineering teams to qualify, troubleshoot, and optimize equipment.
• Create and maintain process and equipment FMEA documentation.
• Provide technical support to manufacturing teams, including troubleshooting and root-cause analysis.
• Support new product introductions through material selection, process development, and technical data analysis.
• Conduct risk assessments, develop mitigation plans, and communicate project progress and results to leadership.
• Support mechanical reliability testing and failure analysis to identify root causes.

Skills

Die attach

Die bonding

Lid attach

RF Power packages

FMEA/DFMEA/PFMEA

SPC

Pareto Analysis

Control Charts

8D

DOE

Project management

Documentation

Troubleshooting

Reliability testing

Education

Bachelor’s or Master’s degree in Mechanical Engineering, Materials Engineering, Industrial Engineering, Applied Science, or related field

Job description

Role: Principal Process Development Engineer

Job Type: Full-time / FTE / Direct Hire

We are seeking an experienced Principal Process Development Engineer to support semiconductor backend assembly and package development, with a focus on RF Power products.

Key Responsibilities:

• Develop and improve backend assembly processes and package technologies for RF Power products.
• Define process specifications, develop process recipes, select materials, and support equipment upgrades.
• Identify potential process, material, and equipment issues and develop effective solutions.
• Drive continuous improvement initiatives focused on quality, process efficiency, reliability, and cost reduction.
• Design and develop customized tooling for high-volume manufacturing equipment.
• Lead verification and qualification activities for new tooling, equipment, and materials.
• Work with equipment vendors, subcontractors, and internal engineering teams to qualify, troubleshoot, and optimize equipment.
• Create and maintain process and equipment FMEA documentation.
• Provide technical support to manufacturing teams, including troubleshooting and root-cause analysis.
• Support new product introductions through material selection, process development, and technical data analysis.
• Conduct risk assessments, develop mitigation plans, and communicate project progress and results to leadership.
• Support mechanical reliability testing and failure analysis to identify root causes.

Required Qualifications:

• Bachelor’s or Master’s degree in Mechanical Engineering, Materials Engineering, Industrial Engineering, Applied Science, or a related field.
• 8+ years of relevant experience in semiconductor package and assembly process development.
• Strong hands-on experience with backend assembly processes such as die attach, die bonding, and lid attach.
• In-depth knowledge of semiconductor backend assembly processes, particularly for RF Power packages.
• Experience with engineering methodologies including FMEA/DFMEA/PFMEA, SPC, Pareto Analysis, Control Charts, 8D, and DOE.
• Strong project management, documentation, communication, and problem-solving skills.
• Solid understanding of semiconductor reliability standards and test methodologies.
• Experience with materials characterization, reliability testing, and failure analysis is preferred.
• Experience supporting low-, medium-, and high-volume manufacturing of RF Power products is a plus.