Staff Hardware Engineer - Ultra-High-Perf Electronics

Broadcom; San Jose (CA); On-site; USD 122,000 - 195,000; Full time

Benefits offered by this job

Discretionary annual bonus

Equity grants

Comprehensive benefits package

401(k) matching

Job summary

Broadcom in San Jose is seeking a Staff Hardware Engineer to design, develop and deliver ultra high‑performance electronic products. You will own all aspects of EE hardware design, from BOM creation to validation, in a one person one board culture, with vendor negotiation and cradle‑to‑grave lifecycle ownership.

You will collaborate with an interdisciplinary team of Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging and Manufacturing engineers, and joint development programs may

Qualifications

• Bachelor's degree in electrical engineering and 8+ years of related experience.
• Experience with high-power SOCs and 2.5D/3D memory packaging.
• Proficiency with high-speed SerDes signaling (112G+).
• Ability to work in cross-functional teams with Manufacturing, Compliance, and Safety.

Responsibilities

• Own all aspects of EE hardware design, including BOM creation, vendor negotiations, circuit/board design, development and validation.
• Cradle-to-grave lifecycle ownership incl. customer trials, field issues and product sustaining.
• Collaborate with interdisciplinary teams (Hardware, ASIC, Signal, Mechanical, Thermal, Packaging, Manufacturing).
• Participate in joint development programs with partner engineering teams.

Skills

High-power SOCs & packaging (2D/2.5D/3

112G SerDes signaling

Power & thermal management

Cross-functional teamwork

Vendor negotiation participation

Education

Bachelor's degree in Electrical Engineering

Tools

Scope & analyzers

Validation tools

Job description

Broadcom in San Jose is seeking a Staff Hardware Engineer to design, develop and deliver ultra high‑performance electronic products. You will own all aspects of EE hardware design, from BOM creation to validation, in a one person one board culture, with vendor negotiation and cradle‑to‑grave lifecycle ownership.

You will collaborate with an interdisciplinary team of Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging and Manufacturing engineers, and joint development programs may