Sr. Product Development Engineer

Micron Technology; Boise (ID); On-site; USD 80,000 - 120,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Robust paid time-off program

Job summary

Micron Technology in Boise, Idaho, is looking for a candidate responsible for managing CPI related issues for DRAM memory products from pathfinding to NPI startup. The role requires a fundamental understanding of key risks in various fabrication and assembly processes.

The ideal applicant will have strong knowledge in DRAM/NAND architecture, chip-package interaction, and a proven track record in quality and reliability assessments. Candidates will benefit from Micron's comprehensive health plans, paid time-off, and family leave initiatives.

Qualifications

• Fundamental understanding of key risks in Fab BEOL and memory array design.
• Knowledge of wafer probe flows and flip chip assembly technologies.

Skills

DRAM/NAND memory device structure and function

Chip-package-interaction

DRAM/NAND memory device fabrication knowledge

Electrical data analysis

Quality and reliability degradation mechanisms

Job description

Responsible for CPI related issues for Micron’s DRAM memory products from pathfinding through NPI start up into HVM. Establish package program plans for new DRAM fab technology process nodes specific to DRAM 3DS products, coordinate DRAM device/package/module end-to-end reviews. Requires a fundamental understanding of key risks in Fab BEOL, Fab memory array design/processes, wafer probe flows, wafer/device bumping & flip chip assembly technologies, package design, assembly processes, and materials & process interaction effects.

Qualifications

• DRAM/NAND memory device structure and function
• Chip-package-interaction (CPI) which includes assembly process understanding & effects of assembly stresses, package design understanding and effects/influence of design decisions, and DRAM/NAND design/process influences
• DRAM/NAND device/package design files and incorporate device design features into CPI and packaging risk assessments
• DRAM/NAND memory device Wafer Probe and Test flows, including electrical data analysis and correlating electrical failures under various temperature and voltage conditions to CPI physical defects
• DRAM/NAND memory device fabrication knowledge, specifically including memory array and back-end-of-line fabrication processes
• DRAM/NAND CPI quality and reliability degradation mechanisms, intrinsic vs extrinsic defects, accelerated reliability stress tests, & sampling statistics to design effective quality and reliability qualification plans screening tests

Benefits

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental, and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays.

EEO Statement

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.