Spice Modeling Engineer

Broadcom; Irvine (CA); On-site; USD 129,000 - 207,000; Full time

Benefits offered by this job

Discretionary annual bonus

Equity grants

401(k) matching

Job summary

Broadcom is seeking an experienced engineer to advance silicon technology and device modeling. You will contribute to 65nm and newer nodes, perform GDS to SPICE flows, and work with Cadence/Virtuoso flows in a collaborative environment.

The role requires hands-on measurement, data analysis automation, and strong communication across a global design team. A MS or PhD with relevant years is highly preferred, with competitive compensation and comprehensive benefits.

Qualifications

• Experience with advanced silicon technology and device modeling.
• Automation skills for data analysis and lab equipment.
• Excellent communication and presentation skills; able to work with a worldwide engineering community.
• MS+10 years or PhD+7 years ideal; strong backgrounds in Materials Science & Physics encouraged.

Skills

Device physics

HSPICE/SPECTRE modeling

DC to RF measurement

Automation for data analysis

Communication skills

Excellent presentation skills

Education

MS + 10 years

PhD + 7 years

Materials Science & Physics background

Tools

Cadence/Virtuoso

GDS to SPICE flow

Job description

Broadcom is the leading provider of silicon solutions to high-performance computing, networking, mobile and consumer market segments in aggregate, covering the widest spectrum of process technologies from the very leading edge to legacy.

This position is within Broadcom's Central Engineering organization, as part of the technology platform team. The technology platform team delivers CAD, design‑access, custom device enhancements to foundry process technologies, silicon correlation and device & reliability modeling functions, all to support the high volume product needs of the diversified businesses.

We are looking for an experienced engineer with the technical knowledge and hands on experience with advanced silicon technology, device modeling concepts, measurement automation, data collection & analysis, and GDS to SPICE design flows for silicon correlation using custom process characterization and modeling test-chips. Layout experience with device modeling test‑structures would be beneficial.

Key requirements:

• Device physics and process technology knowledge with 65nm and newer nodes.
• Device modeling for HSPICE/SPECTRE circuit simulation, and GDS to SPICE flow in Cadence/Virtuoso.
• Device/circuit characterization with DC to RF measurement equipment.
• Automation skills for data‑analysis and lab equipment.
• EE's with MS + 10 years or Ph.D + 7 years are ideal. Engineers with basic qualifications in Materials Science & Physics possessing the needed technical experience are also encouraged to apply.
• Excellent communication and presentation skills needed to work with a world‑wide design engineering community are needed.

Compensation And Benefits

The annual base salary range for this position is USD 129,400.00 To USD 207,000.00.

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

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