Spice Modeling Engineer – Device Physics & Automation

Broadcom Inc.; Irvine (CA); On-site; USD 129,000 - 207,000; Full time

Benefits offered by this job

Medical, dental and vision plans

401(K) with company matching

ESPP

Employee Assistance Program (EAP)

Paid holidays

Sick leave & vacation

Job summary

Broadcom is seeking an experienced engineer for its Central Engineering organization within the technology platform team. The role focuses on CAD, design-access, and device characterization using custom process modeling test-chips.

Experience with 65nm+ nodes and GDS to SPICE flows is important. The team supports high-volume product needs and requires strong analytical skills, collaboration across a global design community, and excellent communication.

Qualifications

• Device physics and process technology knowledge for 65nm and newer nodes.
• Device modeling for HSPICE/SPECTRE circuit simulation, and GDS to SPICE flow in Cadence/Virtuoso.
• Device/circuit characterization with DC to RF measurement equipment.
• Automation skills for data-analysis and lab equipment.
• EE with MS+10 years or PhD+7 years; Materials Science & Physics candidates may apply.
• Excellent communication and presentation skills to work with a worldwide design engineering community.

Skills

Device physics

Device modeling

GDS to SPICE flow

DC to RF measurement

Automation for data-analysis

Communication skills

Education

MS in Electrical Engineering

PhD in Electrical Engineering

MS in Materials Science or Physics

Tools

Cadence/Virtuoso

HSPICE/Spectre

Job description

Broadcom is seeking an experienced engineer for its Central Engineering organization within the technology platform team. The role focuses on CAD, design-access, and device characterization using custom process modeling test-chips.

Experience with 65nm+ nodes and GDS to SPICE flows is important. The team supports high-volume product needs and requires strong analytical skills, collaboration across a global design community, and excellent communication.