Device Characterization & Modeling Engineer (SPICE)

Steinman Recruiting Associates

Austin (TX)

Hybrid

USD 189.000 - 231.000

Vollzeit

14 Tage+

Eine vollständige Bewerbung in einer Minute

Maßgeschneiderter Lebenslauf und Anschreiben – versandbereit.

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Benefits dieser Stelle

Full relocation package
Comprehensive benefits
RSUs/bonus opportunities

Zusammenfassung

Steinman Recruiting Associates is seeking an Engineer for an Austin, TX client. The role focuses on device characterization, SPICE modeling, and reliability, with hands-on lab work and test-structure design for submicron CMOS/BCD devices.

Requires a PhD or MS with industry experience, strong Python scripting, and Cadence ADE exposure. The job offers a hybrid work setup, relocation support, and a high compensation package up to $210,000 DOE.

Qualifikationen

  • PhD/MS with current industry experience in semiconductor device modeling and characterization.
  • Expertise in SPICE model generation, validation, and QA flow.
  • Strong device physics with aging and reliability knowledge.

Aufgaben

  • Own device lab operations and optimize equipment performance.
  • Characterize devices, extract SPICE/aging models, and support silicon tech.
  • Collaborate on test structures and data analysis across CMOS/BCD.

Kenntnisse

Python scripting
SPICE modeling
Device characterization
CMOS/BCD device knowledge
Reliability testing

Ausbildung

PhD in Electrical Engineering
MS in Electrical Engineering

Tools

Cadence ADE
Test probers

Jobbeschreibung

We seek proven Device Characterization & Modeling (SPICE) talent for an Austin client.

A leading global supplier of low-power, high-precision mixed-signal processing solutions. World-class innovators that are hyper-specialized offering game-changing microchips that captivate billions of global users every single day. This client dominates by tightly integrating three core pillars: Ultra-Low-Power, High-Precision Analog Architecture; Patented Hardware-Software Co-Design; and co-developing custom silicon directly with top-tier OEMs.

You will: Have deep expertise in device characterization, test‑chip design, SPICE modeling, and device‑level reliability …Own device lab operations, ensuring equipment is optimized and running flawlessly …Perform a broad range of silicon device characterization, extract accurate SPICE and aging models, and help shape the foundation of our next‑generation semiconductor technologies.

If you thrive at the intersection of hands‑on lab work, modeling, and silicon physics, this is your opportunity to make a direct impact on device performance and long‑term reliability.

What will get our attention:
  • PhD/MS with current industry experience in semiconductor device modeling and characterization.
  • Expertise in SPICE model generation, validation, and QA flow.
  • Strong device physics.
  • Physics of device aging and long‑term reliability mechanisms.
  • Hands‑on deep‑submicron CMOS and BCD device measurements
  • Hands‑on manual, semi‑automatic, and fully automatic probers
  • Able to design test structures (individual devices and arrays) for silicon characterization.
  • Knowledge of both active and passive device structures in CMOS and BCD process technologies.
  • Solid understanding of device noise, mismatch behavior, and how these impact circuit‑level performance.
  • Coding ability in Python, Perl, or similar scripting languages
Highly Desirable:
  • Experience running simulations in Cadence ADE
  • Exposure to digital and analog design flows and broader design methodologies.
  • Ability to stress‑test devices to evaluate post‑stress behavior and safe‑operating‑area (SOA) limits.

Title: Engineer (mid to senior career)

Worksite: Austin, Texas (hybrid). Full relocation package.

Compensation: Base salaries to ~$210,000 DOE. Additional lucrative bonus (s) and RSUs offered. Comprehensive benefits.

Current USA H-1B visa holders and those TN eligible are encouraged to apply.

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