Software Engineering Director/Architect, 3DIC P&R & AI-driven EDA Automation

Cadence; Austin (TX); On-site; USD 120,000 - 160,000; Full time

Job summary

Cadence is seeking a Software Engineer to build scalable EDA flows and AI-driven automation for advanced 3DIC applications. You will develop robust flow-generation, debugging assistance, and platform integration across 3DIC, interposer, and RDL system flows.

You will collaborate with cross-functional teams to design, implement, and validate production-ready solutions using C++, Tcl, Python, and Java, with a focus on performance, reliability, and usability in complex packaging environments.

Qualifications

• Strong background in EDA data structures and algorithms.

Responsibilities

• Build scalable EDA flows using C++, Tcl, Python, and Java.
• Develop AI/LLM-based automation for 3DIC applications, including flow generation and debugging assistants.
• Integrate 3DIC flows into a broader platform system supporting 3DIC, interposer, and RDL flows.
• Design and automate workflows to improve usability, productivity, and debug efficiency.
• Collaborate with cross-functional teams to define requirements and deliver production-quality solutions.

Skills

EDA data structures

Tcl

Python

C++ automation

AI/LLM automation

Education

Bachelor's or Master's in CS/EE

Tools

Innovus

Job description

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

We are looking for a Software Engineer to help build scalable EDA flows and AI-driven automation for advanced 3DIC applications. This role will focus on developing robust flow-generation capabilities, debugging assistance, root-cause analysis, and platform integration for 3DIC, interposer, and RDL system flows.

Core Responsibilities

• Build scalable EDA flows using C++, Tcl, Python, and Java.
• Develop AI/LLM-based automation for 3DIC applications, including flow generation, debugging assistants, and root-cause analysis capabilities.
• Integrate 3DIC flows into a broader platform system supporting 3DIC, interposer, and RDL system flows.
• Design and automate workflows that improve usability, productivity, and debug efficiency for complex package and system-level design challenges.
• Collaborate with cross-functional engineering teams to define requirements, validate flow behavior, and deliver production-quality solutions.

Required Skills

• Strong background in EDA data structures and algorithms.
• Hands‑on experience with Tcl, Python, and C++ automation in EDA tools.
• Experience with DB‑driven design flows, such as Innovus or similar implementation platforms.
• Understanding of 3DIC, interposer, packaging routing, and RDL design flows.
• Knowledge of constraint‑driven design, including timing, signal integrity, DRC, and related implementation constraints.
• Experience handling large‑scale design problems, including high bump‑count designs and multi‑region routing challenges.

Preferred Skills

• Experience with 3DIC, 3.5D, or 2.5D designs.
• Familiarity with signal integrity, EMIR, and thermal considerations in advanced packaging environments.
• Experience with LLM or AI systems, including agent frameworks and prompt‑to‑script automation.
• Knowledge of multi‑tool integration and end‑to‑end flow automation.
• Ability to translate complex EDA workflows into scalable, user‑friendly automation solutions.

Education and Experience

• Bachelor’s or Master’s degree in Computer Science, Electrical Engineering, Computer Engineering, or a related technical field.
• Relevant industry experience developing EDA software, design automation flows, AI/LLM‑enabled engineering tools, or advanced packaging design solutions.

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