Software and Engineering Graduate Roles - HP Solutions (HPS)

Hewlett Packard Enterprise; Fort Collins (CO); On-site; USD 60,000 - 90,000; Full time

Benefits offered by this job

Health insurance

Dental insurance

Vision insurance

Disability insurance

Employee assistance program

Flexible spending account

Life insurance

Paid parental leave

Job summary

Hewlett Packard Enterprise (HP Solutions) is recruiting recent graduates for its software and engineering pipeline. The program targets students and new graduates to learn, grow, and contribute across HP’s global organizations.

The roles emphasize hands-on experience with modern tools, collaboration across teams, and exposure to high-impact projects while offering a structured path for career development and learning in a world-class technology environment.

Qualifications

• Has completed or is in the process of completing a university degree or higher (bachelor’s degree or equivalent)
• Has completed the degree prior to the start date
• Has no more than 24 months of prior work experience professionally related to the graduate hire requisition they are applying to
• No more than 12 months since graduation from a university program
• Able to obtain work authorization in the United States without sponsorship in the future.

Skills

Python

C

C++

CAD

FPGA

EE Design

Data Analysis

Java

JavaScript

Education

Bachelor's degree or equivalent

Tools

Java

Python

C++

React

Node.js

REST APIs

GraphQL

Azure DevOps

AWS CodePipeline

Splunk

RUM

APM

Job description

Software and Engineering Graduate Roles - HP Solutions (HPS) Description

The following posting is a pipeline requisition, meant to accumulate candidates for 2026 & 2027. Qualified applicants will be contacted in concert with the approval and publication of identical, approved positions within HP, Inc. HP occasionally offers work authorization sponsorship for critical need roles. However, this opportunity currently does not offer work authorization sponsorship and HP will not provide any assistance or sign documentation in support of immigration sponsorship including Optional Practical Training (OPT).

About Us

Innovation is in HP’s DNA. From our origins in a Palo Alto garage in 1939, to our current position as one of the world’s leading technology companies, HP has grown to become a leader in technology and corporate culture, inspiring innovators, and entrepreneurs around the globe. HP brings together a portfolio that spans printing, personal computing, software and services to serve more than 1billion customers in over 170 countries. We are committed to fostering a diverse and inclusive workplace that attracts exceptional talent and to supporting our employees to succeed at all levels. We dream in over 35 languages and share one mission: to engineer experiences that amaze.

The Program

The Program: Our future success depends on the innovation and fresh ideas you bring to HP, Inc. We are hiring students and new graduates with a diverse set of skills and experiences to join us, across the different organizations that make us HP, Inc. Our new grad program is intended to help you learn and grow at HP, give you an opportunity to make an impact, and work with leading edge technology. At HP, you’ll use advanced tools and technology to tackle complex challenges that make a real impact on people’s lives.

The Team

The Team: HP Solutions (HPS) is a global organization within HP that helps customers unlock the full value of their technology investments through innovative solutions, services, and support. Leveraging HP's industry-leading portfolio of computing, print, and collaboration technologies, HPS enables organizations to create productive, connected, and secure workplace experiences. From deployment and lifecycle management to customer support and digital workplace solutions, HPS partners with customers at every stage of their technology journey to drive business outcomes, enhance employee experiences, and accelerate innovation.

Skills Areas Were Seeking

• Electrical Engineering: Python, C, EE Design, FPGA, Basic 2D/3D Design - CAD, ASICS(both analog and digital), data conversions- ADC and DAC, DVM, oscilloscope, Logic analyzer
• Software Developer: Coding /Tools/Knowledge Areas: Coding/ Tools: Java, Python, C++, React JS, Node JS, RESTful and GraphQL APIs, Azure DevOps and AWS CodePipeline, RESTful and GraphQL APIs, Splunk observability tools, such as Real User Monitoring (RUM), Application Performance Monitoring (APM), and Log Observer.
• Mechanical Engineering: Mechanical Design, CAD, coding Python, C, Data Science and Analytics: Python, Splunk, SQL, Data Structures, Data Analysis, Automation and AI, Jira, Power BI, Excel and Data, forecasting, modeling, software development.
• Firmware Developer: Firmware/Software development, C++, GHE, GitHub, Debugging, Quality Testing, Software Development Lifecycle
• Cyber Security: Python, Java Script, SQL, encryption algorithms, authentication protocols, firewalls, IDS/IPS systems, and attack vectors, Linux and Windows, and networking concepts; TCP/IP
• Mobile Applications Developer: Apple and/or Android Mobile Application related languages such as Swift, ObjectiveC, Kotlin, Java, etc.
• System Validation Engineer: Software Quality Assurance (SQA), Coding Language(Understanding of code architecture: C, Python, Java), Agile Development (Lean, Scrum, DevOps), Project Management, Data Analysis and Reporting, Computer Architecture, Office365 Systems Integration and Design: Ruby-on-Rails, Java, Angular, AWS, GO, , Familiarity with Test-Driven-Development, printing system architectures, embedded systems, client/server infrastructure, networking technologies, Windows, MAC, Linux operating systems
• UX Design: Figma, Adobe Creative Suite Material Analyst/Engineer: Thermal Analysis, DSC TSC, thermodynamics, fluids, mechanics of materials , fluids, mechanics of materials Reliability testing knowledge, CAD, data center knowledge, electrical components
• Systems Engineer: Python, C++, Familiarity with scripting, algorithm development, and system engineering.
• Engineering Services Designer: Repair and maintenance of complex IC manufacturing equipment (pneumatics, robotics, electronics, software, vacuum theory, etc)

Education and Experience Required

• Has completed or is in the process of completing a university degree or higher (bachelor’s degree or equivalent)
• Has completed the degree prior to the start date
• Has no more than 24 months of prior work experience professionally related to the graduate hire requisition they are applying to (not including internships, teaching assistance, research work, or military experience)
• No more than 12 months since graduation from a university program
• Able to obtain work authorization in the United States without requiring sponsorship in the future.

Preferred Majors/Programs

• Electrical Engineer
• Computer Science
• Mechanical Engineering
• Software Engineering
• Data Science
• Computer Engineering

Preferred Knowledge and Skills

• Project experience demonstrating strong analytical, modeling and research skills
• Strong executive-level presentation skills (storyboarding, development, and delivery)
• Demonstrable success in delivering results in a cross-functional team setting
• Ability to handle ambiguity and unstructured work situations
• Team player who supports others and leads executives and peers through logical reasoning and relationship development
• Strong public speaking and workshop/conversation-facilitation skills
• Demonstrated ability to shape and influence ideas and actions of others
• Working knowledge of MS PowerPoint and MS Excel
• We are looking for visionaries who are ready to make an impact on the way the world works.

Benefits

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including; 4-12 weeks fully paid parental leave based on tenure 11 paid holidays
• Additional flexible paid vacation and sick leave (US benefits overview)

Compensation and Benefits Statement

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

Engineering Schedule

Full time Shift - No shift premium (United States of America)

Travel - Relocation - Equal Opportunity Employer (EEO)

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s). HP is an equal opportunity employer: https://www8.hp.com/h20195/v2/GetDocument.aspx?docname=c08129225For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal”.

Privacy, Terms of Use, and Accessibility

You want to reshape the way the world works. So do we. You’re looking for more than just a job; you’re looking to make a difference. That means creating something new. Something that matters. Something that changes how the world works for the better. A career at HP can help you build the tomorrow you want. Let’s grow together. Our founders believed that business exists when people work together to ‘accomplish something collectively which they could not accomplish separately.’ We uphold a zero-tolerance policy towards discrimination and treat everyone with respect. By maintaining these principles, we empower the HP team to contribute to our collective success and the future of work. Learn more about HP personal data practices at Privacy Statement, Personal Data Rights Notice (where applicable), Accessibility at HP, and Terms. You can be yourself at HP. Learn more