SoC Thermal Engineer — Cutting-Edge Mobile Cooling

Apple, Inc.; San Francisco (CA); On-site; USD 150,000 - 190,000; Full time

Job summary

Apple is seeking a Thermal Engineer to design and validate cooling solutions for high-performance computing systems and to collaborate across functions on thermal management. The role involves simulation, testing, and ensuring reliability across product lines for mobile devices and SOC architectures.

The ideal candidate has deep expertise in silicon device thermal design, packaging, low-power methodologies, and hands-on experience with industry tools such as Ansys IcePak, Fluent, and RedHawk.

Qualifications

• Bachelor's degree required.
• Demonstrated leadership capabilities at the senior engineer level.
• Deep expertise in thermal design for silicon devices and packaging solutions.
• Proven experience with IC physical design parameters and their impact on electrical and thermal performance across various packaging technologies.
• Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches.
• Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics.
• Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs.
• Background in thermal testing for semiconductor devices, packages, PCBs, or mobile products.
• Proficiency with industry-standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk.
• Experience designing and executing experimental test setups and analyzing thermal data.

Responsibilities

• Thermal analysis and design of thermal solutions to address chip energy efficiency and performance scaling.
• Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels.
• Analyzing simulation and measurement results to enhance product thermal management.
• Integrate cooling solutions to next generation SOC architecture design.

Skills

Leadership capabilities

Thermal design for silicon devices

IC design impact on thermal

SoC design methodologies

Advanced packaging processes

Thermal design validation

Thermal testing expertise

Industry tools proficiency

Test setup and data analysis

Education

Bachelor's degree

Tools

Ansys IcePak

Sentinel-TI

Fluent

Cadence Allegro

RedHawk

Job description

Apple is seeking a Thermal Engineer to design and validate cooling solutions for high-performance computing systems and to collaborate across functions on thermal management. The role involves simulation, testing, and ensuring reliability across product lines for mobile devices and SOC architectures.

The ideal candidate has deep expertise in silicon device thermal design, packaging, low-power methodologies, and hands-on experience with industry tools such as Ansys IcePak, Fluent, and RedHawk.