SOC Thermal Engineer — Advanced Cooling & SoC Packaging

Apple; United States; On-site; USD 110,000 - 170,000; Full time

Job summary

Apple is seeking a Thermal Engineer to design and validate cooling solutions for high-performance computing systems. The role involves simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines.

The ideal candidate has a Bachelor's degree and extensive hands-on experience in thermal design, analysis, and validation for silicon devices, packaging, PCBs, or mobile products, using tools like Ansys IcePak, Fluent, and RedHawk.

Qualifications

• Bachelor's degree required.
• Demonstrated leadership capabilities at the senior engineer level.
• Deep expertise in thermal design for silicon devices and packaging solutions.
• Proven experience with IC physical design parameters and their impact on electrical and thermal performance across various packaging technologies.
• Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches.
• Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics.
• Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs.
• Background in thermal testing for semiconductor devices, packages, PCBs, or mobile products
• Proficiency with industry-standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk.
• Experience designing and executing experimental test setups and analyzing thermal data.

Responsibilities

• Design and validate cooling solutions for high-performance computing systems.
• Perform simulations and testing to verify thermal performance.
• Collaborate with multi-functional teams across product lines to ensure thermal reliability.
• Analyze thermal data to optimize performance and reliability across devices and packaging.

Skills

Senior leadership

Thermal design

IC packaging physics

SoC design

Packaging know-how

Thermal testing

Thermal analysis

Test setups

Thermal data analysis

Education

Bachelor's degree

Tools

Ansys IcePak

Sentinel-TI

Fluent

Cadence Allegro

RedHawk

Job description

Apple is seeking a Thermal Engineer to design and validate cooling solutions for high-performance computing systems. The role involves simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines.

The ideal candidate has a Bachelor's degree and extensive hands-on experience in thermal design, analysis, and validation for silicon devices, packaging, PCBs, or mobile products, using tools like Ansys IcePak, Fluent, and RedHawk.