SOC Thermal Engineer

Apple; Austin (TX); On-site; USD 150,000 - 230,000; Full time

Job summary

Apple Inc. is seeking a Thermal Engineer to design and validate cooling solutions for high-performance SoCs and mobile devices.

You will work with cross-functional teams to optimize thermal performance across product lines and contribute to advanced IC packaging research and development. The role requires extensive experience in thermal design, modeling, testing, and a strong background in silicon devices, packaging solutions, and SoC methodologies.

Qualifications

• BS + 10 years of industry experience.
• MSEE + 10 years of industry experience, preferred.
• Demonstrated leadership capabilities at the senior engineer level.
• Deep expertise in thermal design for silicon devices and packaging solutions.
• Proven experience with IC physical design parameters and their impact on electrical and thermal performance across various packaging technologies.
• Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches.
• Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics.
• Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs.
• Background in thermal testing for semiconductor devices, packages, PCBs, or mobile products
• Proficiency with industry-standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk.

Responsibilities

• This position is responsible for thermal analysis and design of thermal solutions to address chip energy efficiency and performance scaling.
• Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels.
• Analyzing simulation and measurement results to enhance product thermal management.
• Integrate cooling solutions to next generation SOC architecture design.

Skills

Thermal design

Leadership

SoC design

Low-power design

Thermal analysis

Thermal testing

Education

Bachelor of Science

MS in Electrical Engineering

Tools

Ansys IcePak

Sentinel-TI

Fluent

Cadence Allegro

RedHawk

Job description

Do you love working on challenges that no one has yet solved? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device’s thermal performance and participate in advanced IC packaging research and development.

Description

The Thermal Engineer will design and validate cooling solutions for high-performance computing systems. The role involves simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines.

Responsibilities

• This position is responsible for thermal analysis and design of thermal solutions to address chip energy efficiency and performance scaling, Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels, Analyzing simulation and measurement results to enhance product thermal management, Integrate cooling solutions to next generation SOC architecture design.

Minimum Qualifications

• BS + 10 years of industry experience.

Preferred Qualifications

• MSEE + 10 years of industry experience, preferred.
• Demonstrated leadership capabilities at the senior engineer level.
• Deep expertise in thermal design for silicon devices and packaging solutions.
• Proven experience with IC physical design parameters and their impact on electrical and thermal performance across various packaging technologies.
• Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches.
• Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics.
• Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs.
• Background in thermal testing for semiconductor devices, packages, PCBs, or mobile products
• Proficiency with industry-standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk.
• Experience designing and executing experimental test setups and analyzing thermal data.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant

At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.

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Apple accepts applications to this posting on an ongoing basis.