SOC Thermal Engineer

Apple; San Francisco (CA); Presencial; USD 150.000 - 190.000; Tempo integral

Resumo da vaga

Apple is seeking a Thermal Engineer to design and validate cooling solutions for high-performance computing systems and to collaborate across functions on thermal management. The role involves simulation, testing, and ensuring reliability across product lines for mobile devices and SOC architectures.

The ideal candidate has deep expertise in silicon device thermal design, packaging, low-power methodologies, and hands-on experience with industry tools such as Ansys IcePak, Fluent, and RedHawk.

Qualificações

• Bachelor's degree required.
• Demonstrated leadership capabilities at the senior engineer level.
• Deep expertise in thermal design for silicon devices and packaging solutions.
• Proven experience with IC physical design parameters and their impact on electrical and thermal performance across various packaging technologies.
• Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches.
• Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics.
• Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs.
• Background in thermal testing for semiconductor devices, packages, PCBs, or mobile products.
• Proficiency with industry-standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk.
• Experience designing and executing experimental test setups and analyzing thermal data.

Responsabilidades

• Thermal analysis and design of thermal solutions to address chip energy efficiency and performance scaling.
• Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels.
• Analyzing simulation and measurement results to enhance product thermal management.
• Integrate cooling solutions to next generation SOC architecture design.

Conhecimentos

Leadership capabilities

Thermal design for silicon devices

IC design impact on thermal

SoC design methodologies

Advanced packaging processes

Thermal design validation

Thermal testing expertise

Industry tools proficiency

Test setup and data analysis

Formação

Bachelor's degree

Ferramentas

Ansys IcePak

Sentinel-TI

Fluent

Cadence Allegro

RedHawk

Descrição da vaga

Do you love working on challenges that no one has yet solved? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device’s thermal performance and participate in advanced IC packaging research and development.

Description

The Thermal Engineer will design and validate cooling solutions for high-performance computing systems. The role involves simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines.

Responsibilities

• This position is responsible for thermal analysis and design of thermal solutions to address chip energy efficiency and performance scaling, Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels, Analyzing simulation and measurement results to enhance product thermal management, Integrate cooling solutions to next generation SOC architecture design.

Minimum Qualifications

• Bachelor's degree required.

Preferred Qualifications

• Demonstrated leadership capabilities at the senior engineer level.
• Deep expertise in thermal design for silicon devices and packaging solutions.
• Proven experience with IC physical design parameters and their impact on electrical and thermal performance across various packaging technologies.
• Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches.
• Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics.
• Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs.
• Background in thermal testing for semiconductor devices, packages, PCBs, or mobile products
• Proficiency with industry‑standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk.
• Experience designing and executing experimental test setups and analyzing thermal data.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant

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