SMT Technician — Precision PCB Assembly & Microscope Work

Leidos LLC; Huntsville (AL); On-site; USD 35,000 - 63,000; Full time

Job summary

Leidos Defense Systems Electronics Manufacturing is seeking a Surface Mount Assembly Technician to join our team that runs SMT equipment to produce a variety of Printed Circuit Board Assemblies (PCBA’s). The role requires handling SMT processes, reading drawings, and maintaining quality under tight schedules.

The candidate will work with stencil printers, SPI, P&P machines, reflow ovens, AOI, X-ray, and hand soldering, while understanding 0402/0603 packages and BGA processing.

Qualifications

• High School Diploma or GED is required.
• Ability to read drawings and follow work instructions.
• Able to stand up to 8 hours daily.
• US Citizen with ability to obtain Secret Clearance.
• Resident of Northern Alabama or willing to relocate.

Responsibilities

• Operate SMT equipment including stencil printer, SPI, pick & place, reflow, AOI, X-ray, and hand soldering.
• Understand electronics packages (0402, 0603, BGA) and how they are processed on SMT lines.
• Work under a microscope during assembly.
• Hand solder SMT and through-hole components.
• Meet day-to-day objectives and contribute to team output.
• Work independently under limited supervision.
• Collaborate with cross-functional and production teams.

Skills

SMT experience

Reading drawings

Microscope work

Hand soldering

Education

High School Diploma/GED

Tools

Stencil Printer

Solder Paste Inspection

Pick & Place

Reflow Oven

AOI

X-ray

Hand soldering equipment

Job description

Leidos Defense Systems Electronics Manufacturing is seeking a Surface Mount Assembly Technician to join our team that runs SMT equipment to produce a variety of Printed Circuit Board Assemblies (PCBA’s). The role requires handling SMT processes, reading drawings, and maintaining quality under tight schedules.

The candidate will work with stencil printers, SPI, P&P machines, reflow ovens, AOI, X-ray, and hand soldering, while understanding 0402/0603 packages and BGA processing.