Light Industrial - Assembler

PlanIT Group, LLC; Town of Florida (NY); On-site; USD 50,000 - 75,000; Full time

Job summary

PlanIT Group, LLC is seeking an experienced Solder Assembler to perform high-mix SMT and through-hole soldering on PCBs for aerospace and defense electronics. The role includes rework of bottom terminated devices (QFNs, BGAs, LGAs) using hot air pencils, hot plates, reflow ovens, and specialized stations, with X-ray and AOI verification.

Applicants should have 5+ years in hands-on SMT/TH soldering in a high-mix, low-volume setting, plus ECO/BOM interpretation and build-to-print practices.

Qualifications

• Minimum 5 years of hands-on SMT/TH solder assembly in a high-mix, low-volume environment (aerospace, defense, or similar).
• Experience removing, replacing, and reworking components including QFNs, BGAs, LGAs using appropriate tools.
• Proficiency in interpreting engineering change orders (ECOs) and BOMs; build-to-print practices where required.
• Certification such as IPCA610, IPC J-STD-001 is preferred.
• Ability to sit for extended periods and lift up to 25 lb (11 kg).
• Vision acuity suitable for detailed microscope work.

Responsibilities

• Perform high-mix SMT and through-hole soldering on PCBs per work orders, drawings, and IPC standards.
• Remove, replace, and rework components including bottom terminated devices using hot air pencils, hot plates, reflow ovens and rework stations.
• Conduct X-ray inspection of reworked bottom terminated parts and evaluate solder joints; document findings.
• Execute board-level verification (visual, AOI, X-ray) and functional testing to ensure conformance to specifications.
• Interpret ECOs and BOMs and apply build-to-print practices where required.

Skills

SMT soldering

Through-hole soldering

Rework & repair

Bottom terminated devices repair (QFNs

BGA

LGA

IPC standards

High-mix, low-volume experience

Solder joint inspection

Visual/AOI/X-ray inspection

Print-to-build documentation

ECOs & BOMs

Microscope work

Tools

X-ray inspection equipment

AOI equipment

Hot air pencils

Hot plates

Rework stations

Job description

We are seeking a highly experienced Solder Assembler with deep expertise in both surface mount technology (SMT) and through hole soldering. The ideal candidate will be proficient in reworking and repairing a wide range of components- including bottom terminated devices such as QFNs, BGAs, and LGAs-using advanced rework equipment and X ray inspection methods. This role supports high mix, low volume production of critical aerospace and defense electronics, requiring meticulous attention to detail and a strong commitment to quality.

• Perform high mix SMT and through hole soldering on printed circuit boards (PCBs) in accordance with work orders, engineering drawings, and IPC standards.
• Remove, replace, and re work components, including bottom terminated devices (QFNs, BGAs, LGAs) using hot air pencils, hot plates, reflow ovens, and specialty rework stations.
• Conduct X ray inspection of re worked bottom terminated parts, evaluate solder joint integrity, and document findings.
• Execute board level verification (visual, AOI, X ray) and functional testing to ensure conformance to specifications.
• Interpret and follow engineering change orders (ECOs) and bills of materials (BOMs); apply "build to print" practices where required.
• Minimum 5 years of handson SMT/TH solder assembly in a highmix, lowvolume environment (aerospace, defense, or similar).
• Additional certification (e.g., IPCA610, IPCJSTD001)
• Ability to sit for extended periods and lift to 25 lb (11 kg).
• Vision acuity (or corrective lenses) sufficient for detailed microscope work.