SIPI Engineer, Sr.

Qualcomm; San Diego (CA); On-site; USD 134,000 - 201,000; Full time

Benefits offered by this job

Discretionary bonus program

RSU grants

Job summary

Qualcomm Technologies, Inc. is seeking a skilled engineer to optimize system performance through collaboration with IC, Package, and PCB designers. The role focuses on substrate constraints, IP specs, and ball assignment impacts on overall performance.

You will perform package extraction, system-level analyses for DDR/SerDes, and develop guidelines for package and PCB design while creating technical docs and presentations. This position offers cross-team exposure across PKG, IP and PCB groups.

Qualifications

• Bachelor's degree in Electrical Engineering, Chemical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
• Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
• PhD in related field may be considered with minimal experience.

Responsibilities

• Perform package extraction for time-domain and frequency-domain analysis.
• Perform system-level analysis for DDR, SerDes & PDN.
• Develop design guidelines for Package and PCB design.
• Create technical documentation and presentations.

Skills

DDR/SerDes experience

Electromagnetics

Transmission line theory

Crosstalk

HFSS

Q3D

Sentinel-PSI

Clarity

ADS

Hspice

Cadence Allegro

Mentor Xpedition

MATLAB

LPDDRx / PCIe / Xlink

Education

Master's degree in Electrical Engineering, Chemical Engineering, Mechanical Engineering, or related field

PhD with minimal experience considered

Bachelor's degree in Electrical Engineering or related field

Tools

HFSS

Q3D

Sentinel-PSI

Clarity

ADS

Hspice

Cadence Allegro

Xpedition

Job description

Company:Qualcomm Technologies, Inc.Job Area:Engineering Group, Engineering Group > Packaging EngineeringGeneral Summary:The Qualcomm CHS (Central Hardware System) has exciting opportunities in the areas of signal integrity and power integrity in next generation server project. The candidate will work with IC, Package and PBC designers to find ways to optimize the overall System performance. The candidate’s first responsibility is working with substrate designers to make sure all system level constraints are met prior to the package Tape-out. The candidate is expected to communicate with PHY owners to understand the Specs for various IPs such as LP6, PCIe, 224G, etc, and also with PCB designers to assess the impact of Ball assignment to the system level performance. This position offers the opportunity to work across multiple organizations such as IP, PKG & PCB design and simulation teams.The responsibilities will include but not be limited to the following:• Perform package extraction for the time domain and frequency domain analysis• Perform system-level analysis for DDR, SerDes & PDN analysis• Develop design guidelines for Package and PCB design• Create technical documentation and presentationsPreferred Qualifications:• 3+ years of experience in DDR/SerDes in Package/PCB/System Design related to compute, Auto and/or Server projects• Experience in Electromagnetics and solid background on transmission line theory & Crosstalk• Proficiency in field solvers such as HFSS, Q3D, Sentinel-PSI and Clarity• Experience in simulation tools such as ADS and Hspice• Working knowledge in Cadence Allegro/APD/Sip or Mentor Xpedition• Experience in utilizing AI to gain efficiency is a strong plus.• Experience in Matlab• Experience in design specifications such as LPDDRx, PCIe, Xlink• Master Degree with 3 ~ 4 years of experiences is preferred, Ph.D with minimal experience is considered as wellMinimum Qualifications:• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.ORMaster's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.ORPhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [e-mail] or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.Pay range and Other Compensation & Benefits :$133,900.00 - $200,900.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link .If you would like more information about this role, please contact Qualcomm Careers .