Process Engineer - Advanced Semiconductor Packaging

Socket.dev; Santa Rosa (CA); On-site; USD 126,930 - 211,550; Full time

Benefits offered by this job

Medical, dental and vision

Health Savings Account

401(k) Plan

Flexible Time Off

Paid Family Leave

Tuition Reimbursement

Job summary

A leading technology firm in Santa Rosa, CA, seeks an experienced professional to lead the development of System in Package (SiP) modules. The ideal candidate will have a degree in relevant engineering fields and proven expertise in semiconductor fabrication processes. Responsibilities include developing fabrication processes, ensuring manufacturability, and leading technology introductions. Candidates must either be local or willing to relocate, and U.S. citizenship or residency is required. The position offers a competitive salary and substantial benefits including medical and 401(k) plans.

Qualifications

• 2-5+ years of experience in semiconductor fabrication/advanced packaging processes.
• Professional experience in III-V compound semiconductors and/or silicon technologies is desired.
• Strong leadership, drive, and ambition to realize novel technologies.

Responsibilities

• Lead the development of next-generation System in Package (SiP) modules.
• Develop and maintain wafer fabrication and package assembly processes.
• Review new designs for manufacturability and provide feedback to designers.

Skills

Design for manufacturing of electromechanical assemblies

Statistical process control (SPC)

Thermocompression / flip chip bonding

Surface Mount Technology (SMT) processes

Die singulation

Semiconductor fabrication processes

Heterogeneous integration, advanced packaging techniques

New technology introduction

New product introduction

Education

BS or MS or PhD in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry

Job description

Responsibilities

We focus on process research and development, process integration, and New Product Introduction. You will lead the development of next-generation System in Package (SiP) modules that will be integrated with microwave and mmWave subsystems across Keysight, serving multiple industries.

• Develop and maintain wafer fabrication processes


• Develop and maintain package assembly processes


• Specify, select and qualify new equipment


• Contribute to process automation


• Review new designs for manufacturability and provide feedback to module designers


• Understand process flows, product design and performance requirements, and lead manufacturing teams to develop new products that meet performance targets


• Lead technical development of new SiP introductions in collaboration with upstream design teams, process and manufacturing teams, and downstream customer teams


• Meet accelerated project schedules; communicate and manage risks


• Develop and maintain high yields while adhering to project schedules

Qualifications

BS or MS or PhD in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry, or relevant fields coupled with 2-5+ years of applicable experience in semiconductor fabrication/advanced packaging processes. We are seeking an industry professional with proven expertise in three or more of the following areas:

• Design for manufacturing of electromechanical assemblies


• Statistical process control (SPC), design of experiments (DOE)


• Thermocompression / flip chip bonding


• Surface Mount Technology (SMT) processes


• Die singulation


• Semiconductor fabrication processes


• Heterogeneous integration, advanced packaging techniques


• New technology introduction


• New product introduction

Professional experience in the following areas is desired:

• III-V compound semiconductors and/or silicon technologies


• Thermal, mechanical and electrical reliability


• Technical project management, project lifecycle

This role requires strong leadership, drive, and ambition to realize a novel technology that differentiates Keysight in the AI market. Excellent interpersonal and communication skills are important for successful cross-functional interactions.

Candidates must be local or willing to relocate to Santa Rosa, CA

This position requires access to certain goods, software, technology, or technical data subject to U.S. export control laws and regulations. Under these laws and regulations, U.S. persons (which includes U.S. citizens, U.S. nationals, lawful permanent residents, refugees, and asylees) working for Keysight can access export-controlled items without authorization from the U.S. government. For any individual who is not a U.S. person, Keysight may need authorization from the U.S. Department of State, U.S. Department of Commerce, or other appropriate federal agency before the individual can access export-controlled items. Candidates must be a U.S. citizen or lawful permanent resident of the U.S., or protected individual, having authorization from the U.S. government for export-controlled items under 8 U.S.C. 1324b(a)(3).

Keysight is an Equal Opportunity Employer.

Benefits

US Employees may be eligible for the following benefits (subject to eligibility and location):

• Medical, dental and vision


• Health Savings Account


• Health Care and Dependent Care Flexible Spending Accounts


• Life, Accident, Disability insurance


• Business Travel Accident and Business Travel Health


• 401(k) Plan


• Flexible Time Off, Paid Holidays


• Paid Family Leave


• Discounts, Perks


• Tuition Reimbursement


• Adoption Assistance


• ESPP (Employee Stock Purchase Plan)


• Restricted Stock Units

Santa Rosa, CA Pay Range: MIN $126,930-MID PT $169,240- MAX $211,550. Note: For other locations, pay ranges will vary by region.