Silicon Photonics Design & Packaging Engineer

Apple; Santa Clara (CA); On-site; USD 120,000 - 180,000; Full time

Job summary

Join a forward-thinking company as a Silicon Photonics Design & Packaging Engineer, where you'll be at the forefront of developing innovative optical interconnect technologies. In this role, you will leverage your extensive experience in silicon photonics to create efficient packaging solutions and optimize assembly processes. Your expertise in optics and photonics will be essential as you work on high-volume, low-cost optical interconnects, making a significant impact in data center connectivity and beyond. If you're passionate about advancing photonic technologies and enjoy collaborative environments, this is the perfect opportunity for you.

Qualifications

• 10+ years of experience in silicon photonics and optical packaging.
• Strong theoretical background in optics and photonics.

Responsibilities

• Develop and optimize Si photonics packaging solutions.
• Define assembly processes and establish optical coupling designs.

Skills

Optics

Photonics

Device/Module Integration

Communication Skills

Teamwork

Education

Bachelor's Degree

M.S. or Ph.D. in Physics (Optics)

M.S. or Ph.D. in Electrical Engineering

M.S. or Ph.D. in Materials Science

M.S. or Ph.D. in Mechanical Engineering

Tools

Photonic IC Design Software

Optical Simulation Tools

Alignment Tools

Job description

Silicon Photonics Design & Packaging Engineer

Location: Santa Clara, California, United States

Department: Hardware

Summary

Posted: Apr 10, 2025

Role Number: 200598891

Silicon photonics (SiPh) technology is crucial for next-generation optical interconnects, already used in data center connectivity and expanding into short-distance board-level applications. A key technology for high-volume, low-cost SiPh optical interconnects is the development of efficient optical I/O device/engine/module architectures, assembly, and optical coupling design for single-mode fiber packaging. We seek a dedicated and passionate Si photonics device, photonic IC design, and optical packaging engineer to join our team. In this prominent role, you will develop Si photonics PIC/engine/chiplet packaging and co-packaging solutions using advanced technologies, define assembly baseline processes, determine package BOM, and establish optical coupling designs optimized for performance, reliability, yield, and cost.

Responsibilities

• Develop and optimize Si photonics PIC/engine/chiplet packaging and co-packaging solutions.
• Define assembly baseline processes and determine package BOM.
• Establish optical coupling design and manufacturing processes focused on performance, reliability, yield, and cost efficiency.

Minimum Qualifications

• Bachelor's degree with 10+ years of relevant industry experience.

Preferred Qualifications

• M.S. or Ph.D. in Physics (Optics), Electrical Engineering, Materials Science, Mechanical Engineering, or related fields.
• Excellent teamwork and communication skills.
• Strong theoretical background in optics and photonics, device/module integration.
• Hands-on experience in photonic IC design, silicon photonics devices (lasers, modulators, PDs, passive components like Si WG, MUX/DeMUX).
• Experience in Si photonics packaging, fiber-coupled device measurement, optical component design, simulation, and qualification.
• Experience with single/multi-mode fiber assembly, active/passive alignment tools, CMOS BEOL wafer processing, flip chip assembly (CoC, CoW, WLP).