Signal Integrity Intern: AI-Driven High-Speed Memory Design

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 70,000 - 90,000; Full time

Job summary

Micron Technology, Inc. is seeking a Signal Integrity Engineer in Boise to support high-speed memory interfaces and power distribution networks across our product portfolio.

You will work with silicon, package, PCB, and system teams to analyze, model, simulate, and measure performance, driving reliability and efficiency. The role emphasizes AI-enabled workflows, automation, and collaboration with multi-functional teams to advance memory technologies such as DRAM, LPDDR, NAND, and HBM.

Qualifications

• 0-2 years of relevant experience in signal integrity, power integrity, high-speed design, or related fields.

Responsibilities

• Support signal integrity and power integrity analysis for high-speed memory interfaces and power distribution networks through modeling, simulation, measurement, and correlation activities.
• Collaborate with silicon, package, product, validation, and system engineering teams to ensure product electrical performance across development stages.
• Develop and evaluate die, package, PCB, and system-level models to identify performance risks and optimization opportunities.
• Apply AI-enabled tools and agentic workflows to improve engineering efficiency, automate analysis, improve reporting, and support technical problem-solving.
• Contribute to methodology development, standards exploration, customer support activities, and documentation of technical findings and recommendations.

Skills

Signal integrity

Power integrity

High-speed design

Electrical engineering

Python

MATLAB

Data analysis

Communication

AI-enabled workflows

Education

Bachelor's degree in Electrical Engineering

Master's degree in Electrical Engineering

Tools

Simulation software

Laboratory measurement equipment

Job description

Micron Technology, Inc. is seeking a Signal Integrity Engineer in Boise to support high-speed memory interfaces and power distribution networks across our product portfolio.

You will work with silicon, package, PCB, and system teams to analyze, model, simulate, and measure performance, driving reliability and efficiency. The role emphasizes AI-enabled workflows, automation, and collaboration with multi-functional teams to advance memory technologies such as DRAM, LPDDR, NAND, and HBM.