Advanced Packaging Engineer – SI/PI

Socionext US

Milpitas (CA)

Hybrid

USD 150,000 - 205,000

Full time

14 days+

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Benefits offered by this job

401(k)

401(k) matching

Employee assistance program

Flexible spending account

Health insurance

Health savings account

Life insurance

Paid time off

Referral program

Vision insurance

Job summary

A leading semiconductor company is seeking a Senior Engineer for Signal Integrity and Power Integrity in Milpitas, CA. This role involves providing expertise in silicon device development, evaluating packaging technologies, and collaborating with cross-functional teams. Ideal candidates should have 8-10 years of semiconductor packaging design experience and knowledge of tools like HFSS and POWER SI. The position offers a hybrid work environment along with competitive benefits including health insurance, paid time off, and a 401(k) matching plan.

Qualifications

8-10 years of experience in semiconductor packaging design and simulations.
Record of success in cross-functional team environment.
Good knowledge of IC package materials and manufacturing.

Responsibilities

Provide support and expertise to the Silicon device development team.
Evaluate new packaging technology and make package recommendations.
Work closely with Package Design/Manufacturing teams and customers.

Skills

Experience with SI/PI tools for package level extraction/simulation

Strong presentation and communication skills

Ability to work with Package Layout engineers

Cross-functional team environment experience

Education

Bachelor’s degree in electrical engineering or related discipline

Tools

HFSS

POWER SI

Job description

Description

Senior Engineer, Signal Integrity and Power Integrity, – Milpitas, CA

Socionext Inc. (SNI) is an innovative enterprise that designs, develops and delivers System-on-Chip solutions to customers worldwide. The company focuses on AR/VR, ADAS, imaging, networking, data storage and other dynamic technologies that drive today’s leading-edge applications. Socionext combines world-class expertise, experience, and an extensive IP portfolio to provide exceptional solutions and ensure a better quality of experience for customers. Founded in 2015, Socionext Inc. is headquartered in Yokohama, and has offices in Japan, Asia, United States and Europe to lead its product development and sales activities. Socionext America Inc. (SNA), a wholly owned subsidiary of SNI.

We are seeking a Senior Signal Integrity/Power Integrity, Engineer to work from our Milpitas, CA. office.

Responsibilities

The Signal Integrity/Power Integrity Engineering function provides support, expertise, and insight to the Silicon device development team through preliminary activities of package selection, routing techniques and necessary simulation work. The position involves diverse responsibilities, including evaluation of new packaging technology, package recommendation for custom devices, substrate design support, device/package qualification. You will be working very closely with Package Design/Manufacturing team in our headquarter and customers in USA. Also, you will be working very closely with Engineering teams located in our Bangalore, INDIA and Santa Clara, CA offices during pre/post sales process.

This Senior position requires experience in the Fabless semiconductor model with a broad knowledge of package technology and manufacturing. Successful candidates will have a deep understanding of a variety of IC package technologies. Candidate should possess specific experience in the following areas: high performance build-up substrates, flip chip assembly or 2.5D packaging and knowledge of Chiplet technology, Optical integrated packages and also experience in extracting/simulating package designs for SI and PI using tools such as HFSS, POWER SI and other leading tools.

Qualifications

Education

Bachelor’s degree in electrical engineering, or other semiconductor packaging related discipline

Required Experience and Skills

8 -10 years of experience in semiconductor packaging design and simulations
Record of success in cross-functional team environment
Good experience with SI/PI tools for package level extraction/simulation
Ability to work with Package Layout engineers.
Strong presentation and communication skills

Preferred Experience And Skills

Good knowledge of IC package materials and manufacturing
Base Pay + Bonus(es)

Equal Opportunity Employer

Socionext America is an equal opportunity employer. We do not discriminate on the basis of sex (including all gender identities and expressions), race, or ethnicity.