Senior TPM - AR Wearables & PCB Programs

Ascendion; United States; On-site; USD 152,000 - 202,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

401(k) retirement plan

Long-term disability insurance

Short-term disability insurance

5 personal days accrued each calendar—

Paid time off and holidays

Ascendion Learning Management System

Job summary

Ascendion is seeking a Technical Program Manager III in Sunnyvale, CA for a business group advancing next-generation AR wearables. You will drive hardware design releases for flex and multi-layer boards, coordinating with electrical engineers and cross-functional teams to ensure robust, compact form factors.

You will manage SMT and FATP end-to-end, monitor schedules, quality, and yield, and interface with APAC manufacturers to ensure readiness and strong supplier relationships, enabling timely

Qualifications

• Must own design releases for flexes and MLBs from early design through production
• Experience managing SMT and FATP builds end-to-end, including schedule, quality, and yield
• Hands-on APAC contract manufacturer management and vendor engagement

Responsibilities

• Direct ownership of design releases for flexes and MLBs from early design through production.
• Collaborate with electrical engineers and cross-functional teams to develop flexible circuits and rigid circuit boards.
• Gather feedback, track schedules, and highlight risks throughout the development process.
• Manage SMT and FATP build end-to-end, optimizing schedule, quality, and yield.
• Engage directly with APAC contract manufacturers, ensuring supplier readiness and managing flex vendor relationships.

Skills

Design releases

APAC vendor management

SMT & FATP management

Job description

Ascendion is seeking a Technical Program Manager III in Sunnyvale, CA for a business group advancing next-generation AR wearables. You will drive hardware design releases for flex and multi-layer boards, coordinating with electrical engineers and cross-functional teams to ensure robust, compact form factors.

You will manage SMT and FATP end-to-end, monitor schedules, quality, and yield, and interface with APAC manufacturers to ensure readiness and strong supplier relationships, enabling timely