Senior Thermal Design Engineer – Next‑Gen Systems

NVIDIA Gruppe; Santa Clara (CA); On-site; USD 152,000 - 253,000; Full time

Benefits offered by this job

Equity and benefits

Job summary

NVIDIA Gruppe is actively seeking a Senior Thermal Product Design Engineer to advance thermal solutions across multiple product lines from concept to production. The role focuses on translating thermal technologies into robust designs, specifications, and manufacturability considerations within a collaborative One Team environment.

Responsibilities include leading thermal concept development, performing CFD simulations, testing thermal assemblies, and presenting data-driven results to drive

Qualifications

• BSME minimum (or equivalent experience).
• 5+ years relevant experience in electronics thermal design.
• Strong understanding of heat transfer and fluid dynamics.
• Experience with thermal testing and data acquisition.
• Experience collaborating in a dynamic cross-functional environment.

Responsibilities

• Work in a dynamic and fast-paced product development environment.
• Design new thermal solutions to enable NVIDIA's next generation of products.
• Investigate relevant technologies and design concepts.
• Perform thermal simulations using industry standard CFD tools.
• Characterize thermal designs and electronic assemblies: building-up physical prototype assemblies, instrumenting those assemblies for testing, carrying out testing with specific diagnostic software, summarizing data, disassembling, modifying and reassembling systems.
• Present analysis summaries and test reports.

Job description

NVIDIA Gruppe is actively seeking a Senior Thermal Product Design Engineer to advance thermal solutions across multiple product lines from concept to production. The role focuses on translating thermal technologies into robust designs, specifications, and manufacturability considerations within a collaborative One Team environment.

Responsibilities include leading thermal concept development, performing CFD simulations, testing thermal assemblies, and presenting data-driven results to drive