Senior Test Architect for Co-Packaged Automotive Module

Teradar; Boston (MA); On-site; USD 150,000 - 230,000; Full time

Job summary

Teradar is building terahertz imaging radar for automotive perception. Our multi-die SoC merges mixed-signal data conversion with a real-time processor and automotive-grade interposer, targeting AEC-Q qualification and volume production with Tier 1 customers.

We seek an engineer to own the product test for this module, from wafer probe to final test. You will define test strategy, drive ATE programs, and manage contract manufacturers to move from first silicon to production-tested parts in a

Qualifications

• Demonstrated ownership of a device from first silicon to volume production.
• 8-15+ years in product or test engineering for production silicon.
• Hands-on experience with production ATE platforms: test program architecture and debug.

Responsibilities

• Lead bench and ATE bring-up for the die and the co-packaged module.
• Own wafer probe and ATE plan from strategy to execution.
• Debug first-silicon issues across analog, digital, and interconnect domains.
• Manage OSATs, contract manufacturers, and test houses.

Skills

Production ATE

Test program design

Wafer probe

DFT testing

Data converter test

Gage R&R

OSAT management

AEC qualification

High-speed test

Education

Electrical Engineering degree

Tools

Probe cards

ATE platforms

Load boards

Job description

Teradar is building terahertz imaging radar for automotive perception. Our multi-die SoC merges mixed-signal data conversion with a real-time processor and automotive-grade interposer, targeting AEC-Q qualification and volume production with Tier 1 customers.

We seek an engineer to own the product test for this module, from wafer probe to final test. You will define test strategy, drive ATE programs, and manage contract manufacturers to move from first silicon to production-tested parts in a