Microelectronics Packaging Engineer (Level 3/4)

0090 CORP-Corporate Office; United States; On-site; USD 108,800 - 163,200; Full time

Benefits offered by this job

Health insurance

Life insurance

Paid time off

Job summary

0090 CORP-Corporate Office is aiming to hire an experienced Electro-Mechanical Engineer to lead mechanical design and testing for high-profile satellite programs. Candidates should have a B.S. in a STEM field and at least 5 years of engineering experience.

The role includes responsibilities in developing advanced micro-circuit designs, ensuring compliance with performance goals, and presenting technical solutions. Benefits include health and life insurance, paid time off, and more.

Qualifications

• B.S. degree in STEM with 5 years of experience or Master's with 3.
• Experience with mechanical design and analysis tools.
• Ability to read and interpret technical documents.

Responsibilities

• Lead mechanical development for RF and EO designs.
• Ensure compliance with hardware requirements.
• Analyze space environments impacting hardware.

Skills

Mechanical design

Analysis

AutoCAD

3D CAD software

Collaboration

Technical presentation

Education

B.S. degree in a STEM field

Master’s degree in STEM

Ph.D. in STEM

Tools

Mechanical design tools

Printed circuit board fabrication

Job description

Relocation Assistance

Relocation assistance may be available.

Clearance Required for Start

No clearance required to start.

Travel

10% of the time.

Position Summary

We seek an experienced Electro-Mechanical Engineer (level3/4) to join our team within the Intelligence Systems Business Unit. The successful candidate will independently lead mechanical design, analysis, integration, and testing for RF and EO aperture designs supporting multiple high‑profile satellite programs. This role is ideal for a technically accomplished and strategic engineer who thrives in fast‑paced, multidisciplinary environments and is eager to take leadership responsibility. The position is located in Linthicum, MD.

Roles and Responsibilities

• Lead the mechanical development of advanced micro‑circuit designs and the assemblies that support them (e.g., RF tile assemblies).
• Develop micro‑circuit advancements funded by internal NGC IRAD.
• Ensure all aspects of hardware development from concept to detailed design, CAD modeling, documentation, fabrication, integration, factory support, and testing.
• Guarantee technical performance of mechanical requirements for space program micro‑circuit hardware or subsystems (tile assemblies) of major satellite programs and meet cost, schedule, and performance goals.
• Understand integration and test processes for space hardware and the special tooling that may be required.
• Present technical solutions and data at milestone reviews.
• Analyze space environments and their impact on space hardware.
• Research and develop procedures, methods, and tools to further micro‑circuit technology and ensure conformance to system requirements.
• Lead or support program meetings to develop root‑cause and corrective actions.
• Troubleshoot and support technicians during integration and test, recommending improvements and optimizations.
• Facilitate knowledge sharing and mentoring.
• Verify space micro‑circuit designs and performance by performing necessary calculations.
• Lead or support department initiatives, recruiting, technology roadmap creation, cross‑campus/sector involvement, and NCTA project leadership.

Basic Qualifications

• Principal (Level3): B.S. degree in a STEM field with 5years of engineering experience; or a Master’s degree in STEM with 3years of experience.
• Senior Principal (Level4): B.S. degree in a STEM field with 8years of engineering experience; Master’s degree in STEM with 6years of experience, or a Ph.D. with 3years of experience.
• Experience presenting complex technical programs and concepts to non‑technical and technical personnel and customers.
• Ability to read and interpret schematics, block diagrams, sketches, oral and written instructions, manufacturer specifications/operation manuals, and analyze hardware configurations.
• Ability to work independently and collaborate with a cross‑functional team of engineers, management, and contractors.
• Minimum 2years of experience with mechanical design and analysis tools; AutoCAD and/or other 3D CAD software packages.
• Ability to obtain and maintain a US TS/SCI security clearance with polygraph (no clearance required to start).

Preferred Qualifications

• Active TS/SCI clearance with polygraph.
• Minimum 2years of mechanical micro‑circuit design experience.
• Experience with printed circuit board fabrication and testing.
• Experience with surface‑mount technology, including process steps to manufacture and test micro‑circuits.
• Demonstrated technical design support of mechanical micro‑circuit design.
• Ability to collaborate with multidisciplinary teams.
• Ability to work in a fast‑paced environment with multiple concurrent projects.

Location and Travel

Work location: Linthicum, MD. Minimal travel is expected.

Salary Range

Primary Level: $108,800.00 – $163,200.00
Secondary Level: $135,800.00 – $203,600.00

Benefits

Includes health insurance coverage, life and disability insurance, savings plan, company‑paid holidays, and paid time off.

Equal Opportunity Employer

Northrop Grumman is an Equal Opportunity Employer. We make decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. citizenship is required for all positions with a government clearance and certain other restricted positions.