Senior Space Mechanical Engineer – High‑Reliability Design

AV; Moorpark (CA); On-site; USD 111,500 - 170,000; Full time

Benefits offered by this job

Medical benefits

401K with company matching

9/80 work schedule

Paid holiday shutdown

Job summary

AV, a leader in space-qualified hardware, is seeking an experienced Mechanical Engineer to lead design and analysis for diverse space and airborne projects. The role focuses on structural and thermal analysis, CAD-driven engineering, and collaboration within multi-disciplinary teams.

You will drive analysis, support integration and test activities, and contribute to high-reliability electronics packaging and opto-mechanical mechanisms.

Qualifications

• Bachelor's degree in mechanical or aerospace engineering
• 12 years' mechanical engineering experience in one or more spacesystems domains
• Structural and thermal analysis including analytical calculations and FEA
• CAD design experience, ideally SolidWorks
• Tolerance analysis and GD&T practices
• Space hardware design, analysis, integration, and test
• Strong technical writing skills for engineering documentation

Responsibilities

• Provide engineering design and analysis leadership to diverse R&D programs and small-volume production contracts
• Lead the structural and thermal analysis of mechanical systems for space and airborne hardware
• Work within a multi-disciplined project team
• Responsible for mechanical design and analysis activity, and support integration and formal acceptance-test activities
• Projects vary from packaging high reliability electronics subsystems to opto-mechanical mechanism design such as gimbal and steering mirror systems
• Other duties as assigned

Job description

AV, a leader in space-qualified hardware, is seeking an experienced Mechanical Engineer to lead design and analysis for diverse space and airborne projects. The role focuses on structural and thermal analysis, CAD-driven engineering, and collaboration within multi-disciplinary teams.

You will drive analysis, support integration and test activities, and contribute to high-reliability electronics packaging and opto-mechanical mechanisms.