Senior Space Electronics Packaging Engineer

L3Harris Technologies, Inc.; Clifton (NJ); On-site; USD 102,000 - 189,000; Full time

Benefits offered by this job

Health and disability insurance

401(k) match

Paid time off

Job summary

L3Harris Technologies, Inc. in Clifton, NJ is seeking a Senior Specialist, Mechanical Engineer to own the space-grade electronic packaging tasks across the full product lifecycle, from requirements through design and test for high-rel spaceflight electronics.

The role emphasizes 3D CAD modeling, thermal and structural analyses, EMI shielding, and close collaboration with Electrical, Radiation, and Manufacturing teams to ensure mission success within SWaP constraints.

Qualifications

• Bachelor’s Degree with 6+ years relevant experience; or Graduate Degree with 4+ years; or 10 years' experience in lieu of degree.
• Experience in space-grade packaging, high-reliability electronics, and flight hardware.

Responsibilities

• Own space-grade electronic packaging tasks across program lifecycle.
• Provide clear technical updates to leadership and customers.
• Generate complete Technical Data Packages (TDPs) and flight assembly drawings.
• Support prototyping, cleanroom integration, and testing of enclosures and thermal management components.
• Execute space environment tests (TVAC, vibration, EMI/EMC) per standards.
• Collaborate with Electrical, Radiation, and Manufacturing engineers on layout and shielding.

Skills

Space-grade packaging

3D CAD modeling

Thermal analysis

Structural analysis

EMI/EMC shielding

PDR/CDR prep

Cross-functional liaison

Documentation

Education

Bachelor’s Degree

Graduate Degree

10+ years in lieu of degree

Tools

Creo Parametric

SolariaPCB

Ansys Mechanical

Job description

L3Harris Technologies, Inc. in Clifton, NJ is seeking a Senior Specialist, Mechanical Engineer to own the space-grade electronic packaging tasks across the full product lifecycle, from requirements through design and test for high-rel spaceflight electronics.

The role emphasizes 3D CAD modeling, thermal and structural analyses, EMI shielding, and close collaboration with Electrical, Radiation, and Manufacturing teams to ensure mission success within SWaP constraints.