Principal SI/PI Design Engineer

Ciena Corporation; New Providence (NJ); On-site; USD 157,100 - 250,900; Full time

Benefits offered by this job

Medical, dental, and vision plans

401(K) with company matching

Employee Stock Purchase Program

Job summary

A leading technology company is seeking a Principal SI/PI Design Engineer to join their New Providence, NJ team. The ideal candidate will own and drive advanced package selection for custom photonic and IC designs. Required qualifications include a BS in Electrical Engineering or Physics and over 5 years of hands-on experience in IC package design. Familiarity with tools such as Advanced Package Designer and SIWave is essential. Competitive salary and comprehensive benefits package offered.

Qualifications

• 5+ years hands-on experience with IC package design.
• Substrate design experience for RF, digital, high speed, and mixed signal die.
• Experience in package design electrical review and SI/PI analysis.

Responsibilities

• Lead the electrical package design for custom in-house photonic, analog, and digital ICs.
• Interface and coordinate with cross-functional groups on new product package selection.
• Simulate and optimize signal/power integrity and RF performance of the package design.

Skills

IC package design

Signal integrity

Power integrity

RF design

Problem-solving skills

Education

BS in Electrical Engineering or Physics

Tools

Advanced Package Designer (APD)

Xpedition Package Designer (XPD)

SIWave

HFSS

Job description

They gather information about your interactions on the site, such as which pages you visit frequently, how long you stay, and the links or buttons you click. They help us record any difficulties you have with the website and help us to evaluate the effectiveness of our advertising. By analyzing this data, we can understand what aspects of our site are effective and identify areas for improvement.* This is a secondary processing purpose.* This is a secondary processing purpose.* This is a primary processing purpose.* This is a secondary processing purpose.Principal SI/PI Design Engineer page is loaded## Principal SI/PI Design Engineerlocations: New Providence - NJtime type: Full timeposted on: Publié aujourd'huijob requisition id: R029568As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact.**How You Will Contribute:**As an SI/PI Design Engineer, you will be an integral part of the Ciena engineering team and lead the electrical package design for custom in-house photonic, analog, and digital ICs supporting next generation optical modules.* Own and drive advanced package selection, new product BGA configuration and package structure* Responsible for package/SIP layout, optimization, design verification and tapeout* Interface and coordinate with cross-functional groups throughout Ciena on new product package selection, feasibility analysis and design* Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out* Simulate and optimize signal/power integrity and RF performance of the package design* Interface and work with CMs and vendors for the sourcing existing designs and future product development**Must Haves:*** BS in Electrical Engineering or Physics* 5+ years hands on experience with IC package design**Assets:*** Substrate design experience for RF, digital, high speed and mixed signal die* Thorough understanding of signal and power integrity fundamentals* Proficient in Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD) tools (Cadence highly preferred)* Fluent in SI/PI and EM simulation tools such as SIWave, HFSS* Experience in package design electrical review, SI/PI analysis* Experience in package design for manufacturing reviews* Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers* Problem solver with strong engineering fundamentals**Pay Range:**The annual salary range for this position is $157,100 - $250,900 USD.Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available.Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission. In addition to competitive compensation, Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time. We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence.Join our to get relevant job alerts straight to your inbox. At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard. Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination.Ciena is an Equal Opportunity Employer, including disability and protected veteran status.If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.