Senior Packaging Engineer, Semiconductor ICs

1010 Analog Devices Inc.; Wilmington (MA); On-site; USD 96,000 - 131,000; Full time

Job summary

Analog Devices, Inc. in Wilmington, MA seeks a packaging development professional to drive design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, SIP, and module products.

The role involves simulations, collaboration across teams, and supplier engagement to optimize yield. Requirements include a PhD or Master’s in a relevant field and 2+ years of packaging experience, plus hands-on use of EMPro/ADS/Sigrity/HFSS.

Qualifications

• PhD or Master’s degree in Electrical, Mechanical, or Materials Science.
• 2+ years in semiconductor packaging development or manufacturing.
• Solid understanding of IC packaging materials and their mechanical, thermal, and electrical behavior.
• Knowledge of IC package structures, substrate technologies, and assembly processes.
• Hands-on with electrical simulation tools (EMPro, ADS, Sigrity, HFSS) and Cadence Allegro is a plus.

Responsibilities

• Drive and support the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, SIP, and module products.
• Perform electrical simulations of IC packages, modules, or systems using commercial tools.
• Collaborate with cross-functional teams to understand product and packaging requirements and resolve technical issues.
• Collaborate with OSAT partners and substrate suppliers to resolve issues, drive process development, and improve yield.
• Establish reliability criteria with quality and reliability teams for semiconductor products across market applications.
• Develop and maintain package design guidelines, process specifications, and technical documentation.

Skills

Semiconductor packaging

Cross-functional teamwork

Electrical simulation

Cadence Allegro

Education

PhD or Master’s degree in Electrical Engineering, Mechanical Engineering, or Materials Science

Tools

EMPro

ADS

Sigrity

HFSS

Cadence Allegro

Job description

Analog Devices, Inc. in Wilmington, MA seeks a packaging development professional to drive design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, SIP, and module products.

The role involves simulations, collaboration across teams, and supplier engagement to optimize yield. Requirements include a PhD or Master’s in a relevant field and 2+ years of packaging experience, plus hands-on use of EMPro/ADS/Sigrity/HFSS.