Senior Rugged Electronics Packaging Engineer

Anduril Industries; Costa Mesa (CA); On-site; USD 146,000 - 170,000; Full time

Job summary

Anduril Industries is redefining defense technology in the U.S. and allied forces, delivering ruggedized compute and communication hardware that endures harsh environments and battlefield conditions.

You will lead enclosure design and packaging with a multi-disciplinary team, turning concepts into field-ready products that meet strict standards. Join a mission-driven team focused on cutting-edge autonomy, AI, and sensor fusion while collaborating with warfighters to refine products through

Qualifications

• Demonstrated ability to design, prototype, and ship ruggedized electronics hardware.
• Past record of design ownership in a team setting, ideally on enclosures or electromechanical packaging.
• High competence with engineering first principles and problem solving.
• 7+ years of professional mechanical engineering experience.
• Hands-on experience packaging electronics for harsh environments with thermal, shock, vibration, sealing and EMI constraints.
• Familiarity with tolerance stack-up analysis and high-volume manufacturing.
• CAD skills and ability to produce GD&T-driven drawings.
• Experience with high-volume manufacturing methods (machining, sheet metal, molding, die casting, composites).
• Demonstrated hands-on fabrication skills.
• BS/MEng/MS/PhD in engineering; US Person required for export controlled information access.

Responsibilities

• Own ruggedized compute and communications hardware from concept generation to real-world use in the field.
• Serve as a key part of a tight-knit product team spanning electrical, thermal, manufacturing, quality, and industrial design.
• Work with customers to understand real battlefield challenges.
• Design novel enclosures, cooling solutions, and PCBAs for those mission sets — from the ground up.
• Solve the hard packaging problems: thermal management, shock and vibration isolation, environmental sealing (IP/ingress), EMI/EMC shielding, and dense component integration in small form factors.
• Use engineering first-principles, analysis, and testing to ensure your designs survive battlefield conditions and meet MIL-STD-810 and MIL-STD-461.
• Get hands-on to build prototypes and first articles.
• Travel to exercises and work alongside warfighters to support and collect feedback on our products.
• Iterate on your designs and work with our manufacturing team to build and deliver them at scale.

Skills

Ruggedized hardware design

Design ownership

Engineering first principles

7+ years mechanical engineering

Electronic packaging

Thermal management

EMI/EMC constraints

Tolerance analysis

High-volume manufacturing

Fabrication skills

Engineering drawings (GD&T)

BS, M.Eng, MS, or PhD in engineering

US Person for export controls

Education

BS, M.Eng, MS, or PhD in engineering

Tools

NX

Teamcenter

ANALYSIS with ANSYS

Job description

Anduril Industries is redefining defense technology in the U.S. and allied forces, delivering ruggedized compute and communication hardware that endures harsh environments and battlefield conditions.

You will lead enclosure design and packaging with a multi-disciplinary team, turning concepts into field-ready products that meet strict standards. Join a mission-driven team focused on cutting-edge autonomy, AI, and sensor fusion while collaborating with warfighters to refine products through